Multiscale entropy complexity analysis of metallic interconnection electromigration noise
Acta Physica Sinica
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Acta Phys. Sin.  2008, Vol. 57 Issue (10): 6545-6550    
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Current Issue| Next Issue| Archive| Adv Search  |   
Multiscale entropy complexity analysis of metallic interconnection electromigration noise
He Liang1, Du Lei1, Chen Jian-Ping1, Zhuang Yi-Qi2, Li Wei-Hua2
(1)西安电子科技大学技术物理学院,西安 710071; (2)西安电子科技大学微电子学院,西安 710071
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