Simulation of residual stress in viscoelastic mold filling process
Acta Physica Sinica
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Acta Phys. Sin.  2012, Vol. 61 Issue (23): 234602     doi:10.7498/aps.61.234602
ELECTROMAGENTISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS Current Issue| Archive| Adv Search  |   
Simulation of residual stress in viscoelastic mold filling process
Yang Bin-Xin1, Ouyang Jie2
1. School of Applied Science, Taiyuan University of Science and Technology, Taiyuan 030024, China;
2. Department of Applied Mathematics, Northwestern Polytechnical University, Xi'an 710129, China
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