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Lu Yimin, Wang Yujie, Xu manman, Wang Hai, Xi Lin. Micro-structural and Optical Properties of Diamond-like Carbon Films Grown by Magnetic field-assisted Laser Deposition. Acta Physica Sinica,
2024, 0(0): 0-0.
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Kang Ya-Bin, Yuan Xiao-Peng, Wang Xiao-Bo, Li Ke-Wei, Gong Dian-Qing, Cheng Xu-Dong. Microstructure building and thermal stability of cermet-based photothermal conversion coatings with layered structures. Acta Physica Sinica,
2023, 72(5): 057103.
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Zhou Kang, Yuan Cong-Long, Li Xiao, Wang Xiao-Qian, Shen Dong, Zheng Zhi-Gang. Localization of blue phase liquid crystal with ordered crystallographic direction and well-defined micro-patterning. Acta Physica Sinica,
2018, 67(6): 066101.
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Lin Lin, Yuan Ru-Qiang, Zhang Xin-Xin, Wang Xiao-Dong. Spreading dynamics of liquid droplet on gradient micro-structured surfaces. Acta Physica Sinica,
2015, 64(15): 154705.
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Wang Chang-Yuan, Yang Xiao-Hong, Ma Yong, Feng Yuan-Yuan, Xiong Jin-Long, Wang Wei. Microstructure and photoluminescence of ZnO：Cd nanorods synthesized by hydrothermal method. Acta Physica Sinica,
2014, 63(15): 157701.
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Yang Duo, Zhong Ning, Shang Hai-Long, Sun Shi-Yang, Li Ge-Yang. Microstructures and mechanical properties of (Ti, N)/Al nanocomposite films by magnetron sputtering. Acta Physica Sinica,
2013, 62(3): 036801.
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica,
2012, 61(19): 198104.
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica,
2012, 61(24): 248501.
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang. Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica,
2012, 61(20): 206601.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica,
2012, 61(1): 018501.
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Directional diffusion of atoms in metal strips/bump interconnects of flip chip. Acta Physica Sinica,
2010, 59(5): 3438-3444.
doi: 10.7498/aps.59.3438
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder joint. Acta Physica Sinica,
2009, 58(3): 1942-1947.
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping. Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica,
2008, 57(10): 6545-6550.
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Zhen Cong-Mian, Ma Li, Zhang Jin-Juan, Liu Ying, Nie Xiang-Fu. Effect of Ti(Cr) underlayer on the magnetic properties and microstructure of CoCrTa film for perpendicular magnetic recording media. Acta Physica Sinica,
2007, 56(3): 1730-1734.
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Chen Chun-Xia, Du Lei, He Liang, Hu Jin, Huang Xiao-Jun, Wei Tao. Fractal character of noise in electromigration in metel interconnection. Acta Physica Sinica,
2007, 56(11): 6674-6679.
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2007, 56(12): 7176-7182.
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Zhou Bing-Qing, Liu Feng-Zhen, Zhu Mei-Fang, Gu Jin-Hua, Zhou Yu-Qin, Liu Jin-Long, Dong Bao-Zhong, Li Guo-Hua, Ding Kun. The microstructure of hydrogenated microcrystalline silicon thin films studied by small-angle x-ray scattering. Acta Physica Sinica,
2005, 54(5): 2172-2175.
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong. Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica,
2005, 54(12): 5872-5878.
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Du Lei, Zhuang Yi-Qi, Xue Li-Jun. Ａｕｎｉｆｉｅｄｍｏｄｅｌｆｏｒ 1 ｆｎｏｉｓｅａｎｄ 1 ｆ2 ｎｏｉｓｅｄｕｅｔｏｅｌｅｃｔｒｏｍｉｇｒａｔｉｏｎｉｎｍｅｔａｌｆｉｌｍ. Acta Physica Sinica,
2002, 51(12): 2836-2841.
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WANG YONG-QIAN, CHEN CHANG-YONG, CHEN WEI-DE, YANG FU-HUA, DIAO HONG-WEI, XU ZHEN-JIA, ZHANG SHI-BIN, KONG GUANG-LIN, LIAO XIAN-BO. THE MICROSTRUCTURE AND ITS HIGH-TEMPERATURE ANNEALING BEHAVIOURS OF a-Si∶O∶H FILM. Acta Physica Sinica,
2001, 50(12): 2418-2422.
doi: 10.7498/aps.50.2418
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