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Zhou Bin, Huang Yun, En Yun-Fei, Fu Zhi-Wei, Chen Si, Yao Ruo-He. Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stresses. Acta Physica Sinica,
2018, 67(2): 028101.
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Song Ming-Hui, Wang Du-Xiang, Bi Jing-Feng, Chen Wen-Jun, Li Ming-Yang, Li Sen-Lin, Liu Guan-Zhou, Wu Chao-Yu. Inverted metamorphic triple-junction solar cell and its radiation hardness for space applications. Acta Physica Sinica,
2017, 66(18): 188801.
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Zhao Ning, Zhong Yi, Huang Ming-Liang, Ma Hai-Tao, Liu Xiao-Ping. Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints. Acta Physica Sinica,
2015, 64(16): 166601.
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He Li-Min, Ji Yu, Lu Yi, Wu Hong-Ye, Zhang Xue-Feng, Zhao Jian-Jun. Magnetic and transport properties of layered perovskite manganites (La1-xEu x)4/3Sr5/3Mn2O7(x=0, 0.15). Acta Physica Sinica,
2014, 63(14): 147503.
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Zhang Yong, Shan Zhi-Fa, Cai Jian-Jiu, Wu Hong-Qing, Li Jun-Cheng, Chen Kai-Xuan, Lin Zhi-Wei, Wang Xiang-Wu. Investigation of inverted metamorphic GaInP/GaAs/In0.3Ga0.7As (1 eV) triple junction solar cells for space applications. Acta Physica Sinica,
2013, 62(15): 158802.
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Zhong Guang-Ming, Du Xiao-Qing, Tang Jie-Ling, Dong Xiang-Kun, Lei Xiao-Hua, Chen Wei-Min. Analysis of influencing factors on current spreading of flip-chip light-emitting diodes (LEDs). Acta Physica Sinica,
2012, 61(12): 127803.
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Lin Xiao-Ling, Xiao Qing-Zhong, En Yun-Fei, Yao Ruo-He. Failure mechanism of FC-PBGA devices under external stress. Acta Physica Sinica,
2012, 61(12): 128502.
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica,
2012, 61(24): 248501.
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang. Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica,
2012, 61(20): 206601.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica,
2012, 61(1): 018501.
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica,
2012, 61(19): 198104.
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Zhang Fei-Peng, Zhang Xin, Lu Qing-Mei, Zhang Jiu-Xing. Electrical transport properties of Ca3－xAgxCo4O9(x=0—0.05) oxide. Acta Physica Sinica,
2010, 59(6): 4211-4215.
doi: 10.7498/aps.59.4211
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Directional diffusion of atoms in metal strips/bump interconnects of flip chip. Acta Physica Sinica,
2010, 59(5): 3438-3444.
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Wu Zhen-Yu, Chai Chang-Chun, Li Yue-Jin, Liu Jing, Wang Jia-You, Yang Yin-Tang. The temperature characteristics of stress-induced voiding in Cu interconnects. Acta Physica Sinica,
2009, 58(4): 2625-2630.
doi: 10.7498/aps.58.2625
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping. Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica,
2008, 57(10): 6545-6550.
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Chen Chun-Xia, Du Lei, He Liang, Hu Jin, Huang Xiao-Jun, Wei Tao. Fractal character of noise in electromigration in metel interconnection. Acta Physica Sinica,
2007, 56(11): 6674-6679.
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. Research on noise correlation dimension of metallic interconnection electromigration. Acta Physica Sinica,
2007, 56(12): 7176-7182.
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica,
2006, 55(10): 5424-5434.
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong. Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica,
2005, 54(12): 5872-5878.
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Du Lei, Zhuang Yi-Qi, Xue Li-Jun. Ａｕｎｉｆｉｅｄｍｏｄｅｌｆｏｒ 1 ｆｎｏｉｓｅａｎｄ 1 ｆ2 ｎｏｉｓｅｄｕｅｔｏｅｌｅｃｔｒｏｍｉｇｒａｔｉｏｎｉｎｍｅｔａｌｆｉｌｍ. Acta Physica Sinica,
2002, 51(12): 2836-2841.
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