Thermomigration in micro interconnects in integrated circuits
Acta Physica Sinica
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Acta Phys. Sin.  2010, Vol. 59 Issue (6): 4395-4402    
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Thermomigration in micro interconnects in integrated circuits
Wu Yi-Ping1, Tao Yuan1, Zhang Jin-Song2, Wang Yong-Guo2
(1)华中科技大学材料科学与工程学院,武汉 430074; (2)上海大学机电工程与自动化学院,上海 200072
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