Through-silicon-via-aware interconnect prediction model for 3D integrated circuirt
Acta Physica Sinica
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Acta Phys. Sin  2012, Vol. 61 Issue (6): 068001     doi:10.7498/aps.61.068001
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Through-silicon-via-aware interconnect prediction model for 3D integrated circuirt
Qian Li-Bo,Zhu Zhang-Ming,Yang Yin-Tang
School of Microelectronics, Xidian University, Xi’an 710071, China
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