A microstructure-based study on electromigration in Cu interconnects
Acta Physica Sinica
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Acta Phys. Sin  2012, Vol. 61 Issue (1): 018501     doi:10.7498/aps.61.018501
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A microstructure-based study on electromigration in Cu interconnects
Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian
Key Laboratory of Ministry of Education for Band-Gap Semiconductor Materials and Devices, School of Microelectronics,linebreak Xidian University, Xi'an 710071, China
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