A molecular dynamics simulation on the relationship between contact angle and solid-liquid interfacial thermal resistance
Acta Physica Sinica
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Acta Phys. Sin  2013, Vol. 62 Issue (11): 110204     doi:10.7498/aps.62.110204
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A molecular dynamics simulation on the relationship between contact angle and solid-liquid interfacial thermal resistance
Ge Song, Chen Min
Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
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