Acta Physica Sinica
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2011, Vol. 60(11): 118001-118001    DOI: 10.7498/aps.60.118001
An analytical thermal model for 3D integrated circuit considering through silicon via
Zhu Zhang-Ming, Zuo Ping, Yang Yin-Tang
School of Microelectronics, Xidian University, Xi’an 710071, China
Received 2010-07-03  Revised 2011-05-14
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