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本工作利用透射电子显微术研究了Pd-Si薄膜固相反应的初始生成相及生成相Pd2Si与(111)取向Si衬底的取向关系随Pd膜厚度、退火温度等因素的变化规律。实验结果表明:在衬底保持室温的条件下,Pd沉积到Si(111)上时也能够生成一层外延的Pd2Si,其厚度足以在常规的选区电子衍射中产生明显的信号。在170℃退火时,Pd-Si反应即可持续到生成200nm厚的外延的Pd2Si。在Pd膜厚度为400nm的条件下,Pd2Si与Si(111)衬底的取向关系为0001(Pd2Si)轴织构。The initial silicide formation during the deposition of Pd to room-temperature Si (111) substrate and the dependence of Pd2Si-Si orientation relationship on Pd film thickness have been studied by TEM. The results show that the only silicide phase formed is Pd2Si under annealing temperature from 170℃ to 600℃. A thin layer of Pd2Si has grown without annealing, even when the substrate is kept in room-temperature. The Pd film thinner than 100 nm leads to epitaxial Pd2Si layer on Si (111), while the Pd film of about 400 nm gives the 0001 Pd2Si fiber texture. Various kinds of defect with high density exist in the silicide film and the interface.







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