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中国物理学会期刊

多孔硅的一种新的后处理方法──微波等离子体辅助钝化处理

CSTR: 32037.14.aps.46.2059

A NEW METHOD FOR POST TREATMENT OF POROUS SILICON:SULFUR PASSIVATION BY MICROWAVE PLASMA ASSISTANCE

CSTR: 32037.14.aps.46.2059
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  • 报道了对多孔硅进行后处理的一种新方法,即真空中微波等离子体辅助的钝化处理.傅里叶变换红外吸收谱表明,经处理的样品表面主要是被SiSx和SiOy所覆盖.与未经处理的样品相比,其发光强度增加约3.5倍,PL峰位蓝移了40nm,而且在空气条件下存放60d后发光强度没有变化.表明这种方法是增加多孔硅发光强度和提高稳定性的有效方法之一.

     

    A new method for post-treatment of PS(porous silicon), sulfur passivation by microwave plasma assistance in vacuum,is reported in this paper.Fourier transform infrared spectrum indicated that the treated sample surface is mainly covered by SiSx and SiOy.Compared with the as etched PS,the photoluminescence (PL) intensity of the sample is 3.5 times stronger,and the 4nm blueshift of the PL peak was observed experimentally;furthermore,the intensity decay of the PL peak hasnot been observed after 60d in the atmosphere.Therefore,sulfur passivation is an effective post treatment for enhancing PL intensity and stabilization of PS.

     

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