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中国物理学会期刊

溶胶-凝胶法制备纳米多孔SiO2薄膜

CSTR: 32037.14.aps.52.3130

Deposition of nanoporous silica thin films by sol-gel

CSTR: 32037.14.aps.52.3130
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  • 以正硅酸乙酯(TEOS)为原料,采用旋转涂敷的方法,结合溶胶-凝胶技术在硅衬底上制备超低介电常数多孔SiO2薄膜.采用两种不同的改性方法对薄膜表面进行改性,傅里 叶变换红外光谱分析发现改性后薄膜中含有大量的—CH3键,从而减少了孔洞塌陷.用扫 描电子显微镜观察薄膜的表面形貌,发现薄膜内孔洞尺寸在70—80 nm之间.调节溶胶pH值,发现pH值越小凝胶时间越长.对改性样品热处理的结果表明,在300 ℃时介电常数最低达2.05.

     

    Low dielectric constant thin film of nanoporous silica synthesized by sol-gel was deposited on Si(100) substrate by spin coating. By detecting —CH3 substituted for —OH species, which can avoid the destruction of network, surface modification was identified by Fourier transform infrared spectroscope. The hole size was about 70-80 nm observed from scanning electron microscope. By adjusting the pH value of the sol, we found that the gel time increased with the decrease o f the pH value of the sol. When heating the modified film at different temperatu res (60-400 ℃), we can obtain the lowest dielectric constant 2.05 at 300 ℃ .

     

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