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中国物理学会期刊

使用SiNx原位淀积方法生长的GaN外延膜中的应力研究

CSTR: 32037.14.aps.54.5450

Residual stress in the GaN epitaxial film prepared by in situ SiNx deposition

CSTR: 32037.14.aps.54.5450
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  • 采用低压MOCVD系统,在生长过程中使用SiNx原位淀积的方法产生纳米掩模,并 在纳米掩模上进行选区生长和侧向外延制备了GaN外延薄膜.使用拉曼光谱和光荧光的手段对 GaN外延膜中的残余应力进行了研究.研究发现,用SiNx原位淀积出纳米掩模后 ,GaN生长将由二维向三维转变,直到完全合并为止.利用拉曼光谱和光荧光谱分别研究了薄 膜中的残余应力,两者符合得很好;这种方法生长出的GaN薄膜的应力分布较传统的侧向外 延更加均匀;并且从中发现随着生长过程中SiNx原位淀积时间的增加,生长在 其上的GaN外延膜中的残余应力减小.这是因为,随着SiNx原位淀积时间的增加 ,SiNx纳米掩模的覆盖度也增大.因此侧向外延区的比例增大,残余应力随之减 小.

     

    GaN epitaxial films were grown on c-face sapphire substrates by metalorganic chemical vapor deposition (MOCVD) with an in situ SiNx deposition insert ed into the normal growth process. The in situ SiNx deposition makes a nanomask on GaN, followed by the epitaxial lateral overgrowth on it. Raman spe ctra and photoluminescence are used to study the stress state of the resulting G aN film. The formation of SiNx nanomask leads to a 2D-3D growth mode transition, which ends in the total coalesce of the GaN film. The distribution o f stress state in this kind of GaN film is more uniform than that of films grown by the conventional epitaxial lateral overgrowth. The data about the relaxation of the stress deduced by the Raman spectra match well with those obtained by ph otoluminescence. These data also show that the more residual stress in the GaN f ilm grown on the SiNx nanomask is relaxed when the time of in situ Si Nx deposition is increased. This is because with the increasing time of in situ SiNx deposition, the wing area of epitaxial lateral overgr owth becomes larger, which will reduce the stress in the GaN thin film grown on it.

     

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