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本工作利用透射电子显微术研究了Pd-Si薄膜固相反应的初始生成相及生成相Pd2Si与(111)取向Si衬底的取向关系随Pd膜厚度、退火温度等因素的变化规律。实验结果表明:在衬底保持室温的条件下,Pd沉积到Si(111)上时也能够生成一层外延的Pd2Si,其厚度足以在常规的选区电子衍射中产生明显的信号。在170℃退火时,Pd-Si反应即可持续到生成200nm厚的外延的Pd2Si。在Pd膜厚度为400nm的条件下,Pd2Si与Si(111)衬底的取向关系为[0001](Pd2Si)轴织构。The initial silicide formation during the deposition of Pd to room-temperature Si (111) substrate and the dependence of Pd2Si-Si orientation relationship on Pd film thickness have been studied by TEM. The results show that the only silicide phase formed is Pd2Si under annealing temperature from 170℃ to 600℃. A thin layer of Pd2Si has grown without annealing, even when the substrate is kept in room-temperature. The Pd film thinner than 100 nm leads to epitaxial Pd2Si layer on Si (111), while the Pd film of about 400 nm gives the [0001] Pd2Si fiber texture. Various kinds of defect with high density exist in the silicide film and the interface.
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