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本文通过实验研究了0.8 μm PD (Partially Depleted) SOI (Silicon-On-Insulator) p 型Metal-oxide-semiconductor-field-effect-Transistor(MOSFET) 经过剂量率为50 rad(Si)/s 的60Co γ射线辐照后的总剂量效应,分析了沟道长度对器件辐照效应的影响.研究结果表明:辐照总剂量相同时,短沟道器件的阈值电压负向漂移量比长沟道器件大,最大跨导退化的更加明显. 通过亚阈值分离技术分析得到,氧化物陷阱电荷是引起阈值电压漂移的主要因素. 与长沟道器件相比,短沟道器件辐照感生的界面陷阱电荷更多.This paper mainly investigates the total dose irradiation effects on 0.8 μm PD SOI PMOS devices which are exposed to 60Co γ-rays at a dose rate of 50 rad(Si)/s. The channel length dependence of SOI PMOS devices at total dose irradiation is investigated. The result shows that the threshold voltage shift is only a little larger for shorter channel devices at the same total dose. However, the degradation of maximum transconductance for shorter channel devices is more significant. We found that the oxide-trapped charge is the main factor impacting the threshold drift. We may conclude that a short channel device can produce more interface trapped charges by using the subthreshold separation technology.
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Keywords:
- total dose radiation /
- threshold voltage shift /
- transconductance degradation /
- interface trapped charges







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