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ECR-PECVD制备Si3N4薄膜沉积工艺的研究

陈俊芳 吴先球 王德秋 丁振峰 任兆杏

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ECR-PECVD制备Si3N4薄膜沉积工艺的研究

陈俊芳, 吴先球, 王德秋, 丁振峰, 任兆杏
cstr: 32037.14.aps.48.1309

INVESTIGATION ON THE DEPOSITION PROCESS OF SILICON NITRIDE THIN FILM PREPARED BY ECR-PECVD

CHEN JUN-FANG, WU XIAN-QIU, WANG DE-QIU, DING ZHEN-FENG, REN ZHAO-XING
cstr: 32037.14.aps.48.1309
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  • 由偏心静电单探针诊断了电子回旋共振等离子体增强化学汽相沉积(ECR-PECVD)反应室内等离子体密度的空间分布规律.结果表明在轴向位置Z=50cm处,直径Φ12cm范围内等离子体密度分布非常均匀.分析了等离子体密度径向均匀性对沉积速率均匀性和薄膜厚度均匀性的影响.讨论了沉积制备一定薄膜厚度的Si3N4薄膜的工艺重复性.研究了各种沉积工艺参数与Si3N4薄膜沉积速率的相互关系.得到了ECR-PECVD技术在沉积薄膜时的工
    The spatial distribution of the ECR plasma density has been measured by using an eccentric Langmuir probe. The result indicates that the plasma density is very uniform in the axis Z=50 cm and radial Φ=12 cm. Effect of the radial uniformity of plasma density on the uniformity of deposition rate and thin film thickness is analyzed. The repeatability to prepare silicon nitride thin film of a specified thickness is discussed. The relation of the deposition process with the deposition rate of silicon nitride thin film is investigated and the dependence of the practical application on process parameters has been obtained for the deposition thin film with ECR-PECVD technology.
    • 基金项目: 国家自然科学基金(批准号:69493501)及广东省自然科学基金(批准号:970317)资助的课题.
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  • 文章访问数:  9397
  • PDF下载量:  1218
  • 被引次数: 0
出版历程
  • 收稿日期:  1998-08-25
  • 刊出日期:  1999-07-20

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