PECVD分层结构对提高氢化非晶硅TFT迁移率的影响

于遥; 张晶思; 陈黛黛; 郭睿倩; 谷至华

doi:10.7498/aps.62.138501

摘要

为了进一步提高氢化非晶硅薄膜晶体管 (a-Si:H TFT) 的场效应电子迁移率, 研究了批量生产条件下对欧姆接触层和栅极绝缘层进行多层制备, 不同的工艺参数对a-Si:H TFT场效应电子迁移率的影响. 研究表明随着对欧姆接触层 (n+层) 分层数的增加, 以及低速生长的栅极绝缘层 (GL层) 和高速生长的栅极绝缘层 (GH 层) 厚度比值提高, a-Si:H TFT的场效应迁移率得到提升. 当n+层分层数达到 3层, GL层和GH层厚度比值为4:11 时, 器件的场效应电子迁移率达到0.66 cm2/V·s, 比传统工艺提高了约一倍, 显著改善了a-Si:H TFT 的电学特性, 并在量产线上得到了验证.

关键词:

Abstract

The amorphous silicon TFT (α-Si thin film transistor) were fabricated in a new structure, in which the ohmic contact layer (n+ layer) and the nitride silicon insulating layer for grid (G-SiNx) were stratified. Various factors which affect the electron mobility of α-Si TFT are studied using orthogonal test. With the increase in the number of n+ layer, the electronic mobility also rises. Besides, G-SiNx should be stratified into a rapid deposition film (GH) and a low-speed growing film (GL). The thickness of GL should be increased, with the thickness of GH reduced accordingly to achieve the electron mobility gradually increasing. Finally, based on the experimental results in the orthogonal combination experiments, the α-Si TFT mobility can stably reach 0.66 cm2/V·s, much higher than the traditional volume production data (0.29 cm2/V·s).

Keywords:

作者及机构信息

1.
复旦大学先进材料实验室, 平板显示中心, 上海 200433;

2.
中航技显示公司, 上海 201100

Authors and contacts

1.
Flat Panel Display Center of Laboratory of Advanced Materials, Fudan University, Shanghai 200433, China;

2.
CATIC display company, Shanghai 201100, China

参考文献

[1]	Lilienfeld J E 1933 US Pat. 1,900 018
[2]	Heil O 1935 Brit. Pat. BP439 457
[3]	Shockley W 1952 Proc. IEEE 40 1365
[4]	Weimer P K 1962 textitProc. IEEE 50 1462
[5]	Shallcross F V 1963 Proc. IEEE 51 851
[6]	LeComber P G, Spear W E, Ghaith A 1979 Electron. Lett. 15 179
[7]	Spear W E, LeComber P G, Kinmond S, Brodsky M H 1976 Appl. Phys. Lett. 28 105
[8]	Zhang X D, Zhao Y, Gao Y T 2005 Acta Phys. Sin. 54 3910 (in Chinese) [张晓丹, 赵颖, 高艳涛 2005 物理学报 54 391]
[9]	Li J, Wu C Y, Zhao S Y 2006 Acta Phys. Sin. 55 6612 (in Chinese) [李娟, 吴春亚, 赵淑云 2006 物理学报 55 6612]
[10]	Hoffman R L, Norris B J, Wager J F 2003 Appl. Phys. Lett. 82 733
[11]	Hidenori Hiramatsu, Kazushige Ueda, Hiromichi Ohta, Toshio Kamiya, Masahiro Hirano, Hideo Hosono 2005 Appl. Phys. Lett. 87 211107
[12]	Liu Z J, Meng Z G, Zhao S Y 2010 Acta Phys. Sin. 59 2775 (in Chinese) [刘召军, 孟志国, 赵淑云 2010 物理学报 59 2775]
[13]	Qiang Lei,Yao Ruo-He 2012 Acta Phys. Sin. 61 087303 (in Chinese) [强蕾, 姚若河 2012 物理学报 61 087303]
[14]	He Y, Hattori R, Kanicki J 2000 IEEE Electron Dev. Lett. 21 590
[15]	Chen X X, Yao R H 2012 Acta Phys. Sin. 61 237104 (in Chinese) [陈晓雪, 姚若河 2012 物理学报 61 237104]
[16]	Nathan A, Kumar A, Sakariya A, Servati P 2004 IEEE J. Solid-State Circuits 39 1477
[17]	Stryahilev D, Sazonov A, Nathan A 2002 J. Vac. Sci. Technol. A 20 1087
[18]	Zhu M F, Xu Z Y 1989 Acta Phys. Sin. 38 1988 (in Chinese) [朱美芳, 许政一 1989 物理学报 38 1995]
[19]	Gu Z H 2007 Manufacturing Technology of Thin Film Transistor (TFT) Array (Shanghai: Fudan University Press) pp36-43 (in Chinese) [谷至华 2007 薄膜晶体管 (TFT) 阵列制造技术, 第一版 (上海: 复旦大学出版社) 第36–43 页]
[20]	Nair V N 1992 Technometrics 34 127
[21]	Shur M, Hack M 1984 J. Appl. Phys. 55 3831
[22]	Shur M, Hack M, Shaw J G 1989 J. Appl. Phys. 66 3371
[23]	Cherie R Kand, Paul Andry (Translated by Liao Y P and Wang J) 2008 Thin-Film Transistors (Beijing: Electronics Industry Press) pp31-33
[24]	Xie Z Y, Long C P, Deng C Y, Lin C W 2007 Chinese Journal of Vaccum Science and Technology 27 341
[25]	LeComber P G, Spear W E, Ghaith A 1979 Electron. Lett. 15 179

施引文献

[1]	Lilienfeld J E 1933 US Pat. 1,900 018
[2]	Heil O 1935 Brit. Pat. BP439 457
[3]	Shockley W 1952 Proc. IEEE 40 1365
[4]	Weimer P K 1962 textitProc. IEEE 50 1462
[5]	Shallcross F V 1963 Proc. IEEE 51 851
[6]	LeComber P G, Spear W E, Ghaith A 1979 Electron. Lett. 15 179
[7]	Spear W E, LeComber P G, Kinmond S, Brodsky M H 1976 Appl. Phys. Lett. 28 105
[8]	Zhang X D, Zhao Y, Gao Y T 2005 Acta Phys. Sin. 54 3910 (in Chinese) [张晓丹, 赵颖, 高艳涛 2005 物理学报 54 391]
[9]	Li J, Wu C Y, Zhao S Y 2006 Acta Phys. Sin. 55 6612 (in Chinese) [李娟, 吴春亚, 赵淑云 2006 物理学报 55 6612]
[10]	Hoffman R L, Norris B J, Wager J F 2003 Appl. Phys. Lett. 82 733
[11]	Hidenori Hiramatsu, Kazushige Ueda, Hiromichi Ohta, Toshio Kamiya, Masahiro Hirano, Hideo Hosono 2005 Appl. Phys. Lett. 87 211107
[12]	Liu Z J, Meng Z G, Zhao S Y 2010 Acta Phys. Sin. 59 2775 (in Chinese) [刘召军, 孟志国, 赵淑云 2010 物理学报 59 2775]
[13]	Qiang Lei,Yao Ruo-He 2012 Acta Phys. Sin. 61 087303 (in Chinese) [强蕾, 姚若河 2012 物理学报 61 087303]
[14]	He Y, Hattori R, Kanicki J 2000 IEEE Electron Dev. Lett. 21 590
[15]	Chen X X, Yao R H 2012 Acta Phys. Sin. 61 237104 (in Chinese) [陈晓雪, 姚若河 2012 物理学报 61 237104]
[16]	Nathan A, Kumar A, Sakariya A, Servati P 2004 IEEE J. Solid-State Circuits 39 1477
[17]	Stryahilev D, Sazonov A, Nathan A 2002 J. Vac. Sci. Technol. A 20 1087
[18]	Zhu M F, Xu Z Y 1989 Acta Phys. Sin. 38 1988 (in Chinese) [朱美芳, 许政一 1989 物理学报 38 1995]
[19]	Gu Z H 2007 Manufacturing Technology of Thin Film Transistor (TFT) Array (Shanghai: Fudan University Press) pp36-43 (in Chinese) [谷至华 2007 薄膜晶体管 (TFT) 阵列制造技术, 第一版 (上海: 复旦大学出版社) 第36–43 页]
[20]	Nair V N 1992 Technometrics 34 127
[21]	Shur M, Hack M 1984 J. Appl. Phys. 55 3831
[22]	Shur M, Hack M, Shaw J G 1989 J. Appl. Phys. 66 3371
[23]	Cherie R Kand, Paul Andry (Translated by Liao Y P and Wang J) 2008 Thin-Film Transistors (Beijing: Electronics Industry Press) pp31-33
[24]	Xie Z Y, Long C P, Deng C Y, Lin C W 2007 Chinese Journal of Vaccum Science and Technology 27 341
[25]	LeComber P G, Spear W E, Ghaith A 1979 Electron. Lett. 15 179

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