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a-Si∶O∶H薄膜微结构及其高温退火行为研究

王永谦 陈长勇 陈维德 杨富华 刁宏伟 许振嘉 张世斌 孔光临 廖显伯

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a-Si∶O∶H薄膜微结构及其高温退火行为研究

王永谦, 陈长勇, 陈维德, 杨富华, 刁宏伟, 许振嘉, 张世斌, 孔光临, 廖显伯

THE MICROSTRUCTURE AND ITS HIGH-TEMPERATURE ANNEALING BEHAVIOURS OF a-Si∶O∶H FILM

WANG YONG-QIAN, CHEN CHANG-YONG, CHEN WEI-DE, YANG FU-HUA, DIAO HONG-WEI, XU ZHEN-JIA, ZHANG SHI-BIN, KONG GUANG-LIN, LIAO XIAN-BO
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  • 以微区Raman散射、X射线光电子能谱和红外吸收对等离子体增强化学气相沉积(PECVD)法制备的氢化非晶硅氧(a-Si∶O∶H)薄膜微结构及其退火行为进行了细致研究.结果表明a-Si∶O∶H薄膜具有明显的相分离结构,富Si相镶嵌于富O相之中,其中富Si相为非氢化四面体结构形式的非晶硅(a-Si),富O相为Si,O,H三种原子随机键合形成的SiOx∶H(x≈1.35).经1150℃高温退火,薄膜中的H全部释出;SiOx∶H(x≈1.35)介质在析出部分Si原子的同
    The microstructure and its annealing behaviours of a Si∶O∶H film prepared by PECVD are investigated in detail using micro Raman spectroscopy, X-ray photoelectron spectroscopy and Infrared absorption spectroscopy. The results indicate that the as deposited a-Si∶O∶H film is structural inhomogeneous, with Si-riched phases surrounded by O-riched phases. The Si-riched phases are found to be nonhydrogenated amorphous silicon (a-Si) clusters, and the O riched phases SiOx∶H ( x ≈1.35) are formed by random bonding of Si, O and H atoms. By high temperature annealing at 1150℃, the SiOx∶H ( x ≈1.35) matrix is shown to be transformed into SiO2 and SiOx (x ≈0.64), during which all of the hydrogen atoms in the film escape and some of silicon atoms are separated from the SiOx∶H ( x ≈1.35) matrix;The separated silicon atoms are found to be participated in the nucleation and growth processes of solid phase crystallization of the a Si-clusters, nano-crystalline silicon (nc-Si) is then formed. The microstructure of the annealed film is thereby described with a multi shell model, in which the nc- Si clusters are embedded in SiOx (x =0.64) and SiO2. The former is located at the boundaries of the nc-Si clusters, with a thickness comparable with the scale of nc-Si clusters, and forms the transition oxide layer between the nc-Si and the SiO2 matrix.
    • 基金项目: 国家自然科学基金(批准号:69976028);国家重点基础研究发展计划项目(批准号:2000028201)资助的课题.
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  • PDF下载量:  587
  • 被引次数: 0
出版历程
  • 收稿日期:  2001-05-30
  • 修回日期:  2001-06-22
  • 刊出日期:  2001-06-05

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