Effects of the technology of implanting nitrogen into buried oxide layer on the characteristics of partially depleted SOI nMOSFET

Zheng Zhong-Shan; Liu Zhong-Li; Zhang Guo-Qiang; Li Ning; Fan Kai; Zhang En-Xia; Yi Wan-Bing; Chen Meng; Wang Xi

doi:10.7498/aps.54.348

Abstract
The effects, caused by the process of the implantation of nitrogen in the buried oxide layer of SIMOX wafer, on the characteristics of partially depleted silicon_on_insulator nMOSFET have been studied. The experimental results show that the channel electron mobilities of the devices fabricated on the SIMON (separation by implanted oxygen and nitrogen) wafers are lower than those of the devices made on the SIMOX (separation by implanted oxygen) wafers. The devices corresponding to the lowest implantation dose have the lowest mobility within the range of the implantation dose given in this paper. The value of the channel electron mobility rises slightly and tends to a limit when the implantation dose becomes greater. This is explained in terms of the rough Si/SiO2 interface due to the process of implantation of nitrogen. The increasing negative shifts of the thre shold voltages for the devices fabricated on the SIMON wafers are also observed with the increase of implanting dose of nitrogen. However, for the devices fabri cated on the SIMON wafers with the lowest dose of implanted nitrogen in this pap er, their threshold voltages are slightly larger on the average than those prepa red on the SIMOX wafers. The shifts are considered to be due to the increment of the fixed oxide charge in SiO2 layer and the change of the density of the int erface-trapped charge with the value and distribution included. In particular, t he devices fabricated on the SIMON wafers show a weakened kink effect, compared to the ones made on the SIMOX wafers.

Keywords:
SOI /

nMOSFET /

nitrogen implantation /

electron mobility /

threshold voltage
Authors and contacts
Zheng Zhong-Shan²,

Liu Zhong-Li¹,

Zhang Guo-Qiang¹,

Li Ning¹,

Fan Kai¹,

Zhang En-Xia³,

Yi Wan-Bing³,

Chen Meng³,

Wang Xi³

(1)中国科学院半导体研究所微电子研究与发展中心,北京 100083; (2)中国科学院半导体研究所微电子研究与发展中心,北京 100083;济南大学物理系，济南 250022; (3)中国科学院上海微系统与信息技术研究所,上海 200050
References

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Vol. 54, Issue 1 - 2005-01-05

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Effects of the technology of implanting nitrogen into buried oxide layer on the characteristics of partially depleted SOI nMOSFET

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