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2015, 64(2): 028501.
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Yang Qing-Ling, Tan Yik-Yee, Wu Xing, Sim Kok Swee, Sun Li-Tao. In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bonding. Acta Physica Sinica,
2015, 64(21): 216804.
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2014, 63(19): 197101.
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2014, 63(17): 178801.
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Chen Li-Qun, Yu Tao, Peng Xiao-Fang, Liu Jian. The site preference of refractory element W in NiAl dislocation core and its effects on bond characters. Acta Physica Sinica,
2013, 62(11): 117101.
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Jiang Li-Hua, Zeng Xiang-Bin, Zhang Xiao. The variations in composition and bonding configuration of SiNx film under high annealing temperature treatment. Acta Physica Sinica,
2012, 61(1): 016803.
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2012, 61(12): 127101.
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2011, 60(10): 104210.
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2009, 58(4): 2565-2571.
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2008, 57(3): 1840-1845.
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2008, 57(6): 3661-3665.
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Song Ai-Jun, Han Lei. Study of nonlinear identification of time series of vibration on transducer in ultrasonic bonding system. Acta Physica Sinica,
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2006, 55(4): 1936-1941.
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2005, 54(9): 4334-4339.
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1986, 35(6): 725-730.
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