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A compact interconnect temperature distribution model considering the via effect and the heat fringing effect

Zhu Zhang-Ming Hao Bao-Tian Qian Li-Bo Zhong Bo Yang Yin-Tang

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A compact interconnect temperature distribution model considering the via effect and the heat fringing effect

Zhu Zhang-Ming, Hao Bao-Tian, Qian Li-Bo, Zhong Bo, Yang Yin-Tang
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  • Abstract views:  7147
  • PDF Downloads:  1096
  • Cited By: 0
Publishing process
  • Received Date:  05 April 2009
  • Accepted Date:  09 June 2009
  • Published Online:  05 May 2009

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