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The impact of interface charges at the heterojunction on the carriers transport in abrupt InP/InGaAs heterojunction bipolar transistor

Zhou Shou-Li Li Jia Ren Hong-Liang Wen Hao Peng Yin-Sheng

Citation:

The impact of interface charges at the heterojunction on the carriers transport in abrupt InP/InGaAs heterojunction bipolar transistor

Zhou Shou-Li, Li Jia, Ren Hong-Liang, Wen Hao, Peng Yin-Sheng
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  • The carriers transport at the base-emitter interface of abrupt heterojunction bipolar transistors (HBTs) is controlled by thermionic emission and tunneling, which depends on the form and height of the energy barriers. The interface charges at the heterojunction disturb the energy barriers, thus bringing about the change of the electrical characteristics of HBT. Based on thermionic-field-diffusion model which combines the drift-diffusion transport in the bulk of the transistor with the thermionic emission and tunneling at the interface, a conclusion can be drawn that the positive interface charges can improve the electrical characteristics of abrupt InP/InGaAs HBT, while the negative interface charges deteriorate the devices.
    • Funds: Project supported by the Natural Science Foundation of Zhejiang Province, China (Grant No. LY12F04003), and the Open Fund of State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China (Grant No. FMI2009-08).
    [1]

    Cui H L, Ren X M, Huang H 2012 Journal of Optoelectronics Laser 23 1067 (in Chinese) [崔海林, 任晓敏, 黄辉 2012 光电子·激光 23 1067]

    [2]

    Xu A H, Zou L, Chen X J, Qi M 2004 Chinese Journal of Rare Metals 28 516 (in Chinese) [徐安怀, 邹璐, 陈晓杰, 齐鸣 2004 稀有金属 28 516]

    [3]

    Jung H T, Wen S L, Chao Y T, Ye S S, Ma Y C, Jhou J C, Wu Y R, Ouyang J J 2012 Thin Solid Films 521 172

    [4]

    Liu H G, Jin Z, Su Y B, Wang X T, Chang H D, Zhou L, Liu X Y, Wu D X 2010 Chin. Phys. Lett. 27 058502

    [5]

    Chen T P, Lee C J, Chen L Y, Tsai T H, Liu Y J, Huang C C, Chen T Y, Cheng S Y, Liu W C 2009 Superlattices and Microstructures 46 715

    [6]

    Eladl S M 2008 Microelectronics Journal 39 1649

    [7]

    Gourab D, Sukla B 2012 Journal of semiconductors 33 054002

    [8]

    Fuente J G, Viktor K 2002 Solid-State Electronics 46 1273

    [9]

    Yang K, East J R, Haddad G I 1994 IEEE Trans Electron Devices 41 138

    [10]

    Zhou S L, Ren X M 2008 Journal of Semiconductors 29 741 (in Chinese) [周守利, 任晓敏 2008 半导体学报 29 741]

    [11]

    Zhou S L, Yang W C, Ren H L, Li J 2012 Acta Phys. Sin. 61 128501 (in Chinese) [周守利, 杨万春, 任宏亮, 李伽 2012 物理学报 61 128501]

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    Zhang Y R, Zhang B, Li Z J, Deng X C 2010 Chin. Phys. B 19 067102

    [13]

    Jain S C, Roulston D J 1991 Solid-State Electronics 34 453

    [14]

    Leeor K, Yoram S 1999 Surface Science Reports 37 1

    [15]

    Se W K, Kang S R, Seung H S, Kwan Y K, Gu C K, Lee S Y, Chang M C, So R P, Jun H P, Ki C C, Song K J, Kim D H, Dong M K 2008 Microelectronics Reliability 48 382

    [16]

    Kaipa P K, Amitava D 1998 Solid-State Electronics 42 1779

  • [1]

    Cui H L, Ren X M, Huang H 2012 Journal of Optoelectronics Laser 23 1067 (in Chinese) [崔海林, 任晓敏, 黄辉 2012 光电子·激光 23 1067]

    [2]

    Xu A H, Zou L, Chen X J, Qi M 2004 Chinese Journal of Rare Metals 28 516 (in Chinese) [徐安怀, 邹璐, 陈晓杰, 齐鸣 2004 稀有金属 28 516]

    [3]

    Jung H T, Wen S L, Chao Y T, Ye S S, Ma Y C, Jhou J C, Wu Y R, Ouyang J J 2012 Thin Solid Films 521 172

    [4]

    Liu H G, Jin Z, Su Y B, Wang X T, Chang H D, Zhou L, Liu X Y, Wu D X 2010 Chin. Phys. Lett. 27 058502

    [5]

    Chen T P, Lee C J, Chen L Y, Tsai T H, Liu Y J, Huang C C, Chen T Y, Cheng S Y, Liu W C 2009 Superlattices and Microstructures 46 715

    [6]

    Eladl S M 2008 Microelectronics Journal 39 1649

    [7]

    Gourab D, Sukla B 2012 Journal of semiconductors 33 054002

    [8]

    Fuente J G, Viktor K 2002 Solid-State Electronics 46 1273

    [9]

    Yang K, East J R, Haddad G I 1994 IEEE Trans Electron Devices 41 138

    [10]

    Zhou S L, Ren X M 2008 Journal of Semiconductors 29 741 (in Chinese) [周守利, 任晓敏 2008 半导体学报 29 741]

    [11]

    Zhou S L, Yang W C, Ren H L, Li J 2012 Acta Phys. Sin. 61 128501 (in Chinese) [周守利, 杨万春, 任宏亮, 李伽 2012 物理学报 61 128501]

    [12]

    Zhang Y R, Zhang B, Li Z J, Deng X C 2010 Chin. Phys. B 19 067102

    [13]

    Jain S C, Roulston D J 1991 Solid-State Electronics 34 453

    [14]

    Leeor K, Yoram S 1999 Surface Science Reports 37 1

    [15]

    Se W K, Kang S R, Seung H S, Kwan Y K, Gu C K, Lee S Y, Chang M C, So R P, Jun H P, Ki C C, Song K J, Kim D H, Dong M K 2008 Microelectronics Reliability 48 382

    [16]

    Kaipa P K, Amitava D 1998 Solid-State Electronics 42 1779

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Publishing process
  • Received Date:  25 March 2013
  • Accepted Date:  22 May 2013
  • Published Online:  05 September 2013

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