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Micro-mechanism of damping vibration attenuation on porous metal coating

Jiang Wen-Quan Du Guang-Yu Ba De-Chun Yang Fan

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Micro-mechanism of damping vibration attenuation on porous metal coating

Jiang Wen-Quan, Du Guang-Yu, Ba De-Chun, Yang Fan
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  • Based on molecular dynamics method and in-situ scanning electron microscopy (SEM) observations, the damping efficiency of the porous metal coating is discussed in this paper. Molecular dynamics simulation is performed to study the plastic deformations of Cu films with vibration. In the simulation, embedded atom method (EAM) is selected and in the method an interatomic potential function is used. And porous copper coating is carried out for calculating by using velocity-verlet algorithm. The plastic deformation is due to the dislocation nucleation near free surfaces, and the dislocation is shaped into forward emission in the crystal orientation near the defects. At the same time, the change curves of stress and strain are drawn by origin software. Damping factor (η) is calculated by using the time of strain lagging stress. The regulation of elastic potential energy attenuation is obtained by energy calculation. On the other hand, in-situ tensile/compression experiment is conducted by the FEI Quanta 200 SEM with a maximum load capacity of 2 kN at room temperature. A copper layer is deposited on the surface of the polyimide film by the electron beam evaporation deposition method. The thickness of the copper layer is 10 μm and the thickness of polyimide is 175 μm. Using the scanning electron microscope, microstructures of the coating are observed. It could be seen that the coating and the polyimide film are both better in compactness. Using in-situ testing machine at SEM, the samples with and without copper coatings are respectively tested under tensile and unloading. The rate of displacement loading is 2 mm/min, the results of load (F) and displacement (l') are printed every 0.1 s. The loading direction is horizontal. During in-situ tensile/compression test, the straining is stopped several times in order to make the observations and take micrographs. The digital SEM images are directly transferred to a computer via a direct memory access type A/D converter, which can rapidly capture clear images of the 1024×943 pixel frames. The simulations and experimental results indicate that the dislocation near defects get rid of weak pinning points and limit to the strong pinning point, the internal friction is generated due to the change of dislocation and the relative sliding near grain boundary, and the stored elastic potential energy is consumed, which causes the damping effect of the film.
    • Funds: Project supported by the Young Scientists Fund of the National Natural Science Foundation of China (Grant No. 51005043), the Fundamental Research Funds for the Central Universities of Ministry of Education of China (Grant Nos. N130403012, N140301001), and the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20120042110031).
    [1]

    Tian Y, Huang L, Luo M K 2013 Acta Phys. Sin. 62 050502 (in Chinese) [田艳, 黄丽, 罗懋康 2013 物理学报 62 050502]

    [2]

    Yu S J 2014 Acta Phys. Sin. 63 116801 (in Chinese) [余森江 2014 物理学报 63 116801]

    [3]

    Zhang L Y, Jin G X, Cao L, Wang Z Y

    [4]

    Ge T S 2000 Foundation of Solid Internal Friction Theory: Grain Boundary Relaxation and Structure (Beijing: Science Press) pp442-526 (in Chinese) [葛庭燧 2000 固体内耗理论基础\pzh 晶界弛豫与晶界结构 (北京: 科学出版社) 第442-526页]

    [5]

    Masti R S, Sainsbury M G 2005 Thin Wall. Struct. 43 1355

    [6]

    Patsias S, Tassini N, Lambfinou K 2006 Mater. Sci. Eng. A 442 504

    [7]

    Yin F, Ohsawa Y, Sato A, Kawahara K 2001 Mater. Trans. 42 385

    [8]

    Dao M, Lu L, Asaro R J, de Hosson J T M, Ma E

    [9]

    Liu S S, Wen Y H, Zhu Z Z 2008 Chin. Phys. B 17 2621

    [10]

    Yu L M, Ma Y, Zhou C G, Xu H B 2005 Int. J. Solids Struct. 42 3045

    [11]

    Choi D H, Nix W D 2006 Acta Mater. 54 679

    [12]

    Zhang L, Lü C, Kiet T, Pei L Q, Zhao X

    [13]

    Muhammad I, Fayyaz H, Muhammad R

    [14]

    Li X, Cai W, An J, Kim S, Nah J, Yang D, Piner R, Velamakanni A, Jung I, Tutuc E, Banerjee S K, Colombo L, Ruoff R S

    [15]

    Zhang Q, Hiroyuki T 2011 Acta Phys. Sin. 60 114103 (in Chinese) [张强, 户田裕之 2011 物理学报 60 114103]

    [16]

    Du G Y, Sun W, Ba D C, Han Q K 2014 CN Patent 103602955A (in Chinese) [杜广煜, 孙伟, 巴德纯, 韩清凯 2014 CN103602955A]

    [17]

    Rozmanov D, Kusalik P G 2010 Phys. Rev. E 81 056706

    [18]

    Guo Q N, Yue X D, Yang S E, Huo Y P 2010 Comput. Mater. Sci. 50 319

    [19]

    Yuan Q, Zhao Y P

    [20]

    Ao B Y, Xia J X, Chen P H, Hu W Y, Wang X L

    [21]

    Fan J H 2008 Multiscale Analysis for Deformation and Failure of Materials (Beijing: Science Press) pp40-132 (in Chinese) [范镜泓 2008 材料变形与破坏的多尺度分析 (北京: 科学出版社) 第40-132页]

  • [1]

    Tian Y, Huang L, Luo M K 2013 Acta Phys. Sin. 62 050502 (in Chinese) [田艳, 黄丽, 罗懋康 2013 物理学报 62 050502]

    [2]

    Yu S J 2014 Acta Phys. Sin. 63 116801 (in Chinese) [余森江 2014 物理学报 63 116801]

    [3]

    Zhang L Y, Jin G X, Cao L, Wang Z Y

    [4]

    Ge T S 2000 Foundation of Solid Internal Friction Theory: Grain Boundary Relaxation and Structure (Beijing: Science Press) pp442-526 (in Chinese) [葛庭燧 2000 固体内耗理论基础\pzh 晶界弛豫与晶界结构 (北京: 科学出版社) 第442-526页]

    [5]

    Masti R S, Sainsbury M G 2005 Thin Wall. Struct. 43 1355

    [6]

    Patsias S, Tassini N, Lambfinou K 2006 Mater. Sci. Eng. A 442 504

    [7]

    Yin F, Ohsawa Y, Sato A, Kawahara K 2001 Mater. Trans. 42 385

    [8]

    Dao M, Lu L, Asaro R J, de Hosson J T M, Ma E

    [9]

    Liu S S, Wen Y H, Zhu Z Z 2008 Chin. Phys. B 17 2621

    [10]

    Yu L M, Ma Y, Zhou C G, Xu H B 2005 Int. J. Solids Struct. 42 3045

    [11]

    Choi D H, Nix W D 2006 Acta Mater. 54 679

    [12]

    Zhang L, Lü C, Kiet T, Pei L Q, Zhao X

    [13]

    Muhammad I, Fayyaz H, Muhammad R

    [14]

    Li X, Cai W, An J, Kim S, Nah J, Yang D, Piner R, Velamakanni A, Jung I, Tutuc E, Banerjee S K, Colombo L, Ruoff R S

    [15]

    Zhang Q, Hiroyuki T 2011 Acta Phys. Sin. 60 114103 (in Chinese) [张强, 户田裕之 2011 物理学报 60 114103]

    [16]

    Du G Y, Sun W, Ba D C, Han Q K 2014 CN Patent 103602955A (in Chinese) [杜广煜, 孙伟, 巴德纯, 韩清凯 2014 CN103602955A]

    [17]

    Rozmanov D, Kusalik P G 2010 Phys. Rev. E 81 056706

    [18]

    Guo Q N, Yue X D, Yang S E, Huo Y P 2010 Comput. Mater. Sci. 50 319

    [19]

    Yuan Q, Zhao Y P

    [20]

    Ao B Y, Xia J X, Chen P H, Hu W Y, Wang X L

    [21]

    Fan J H 2008 Multiscale Analysis for Deformation and Failure of Materials (Beijing: Science Press) pp40-132 (in Chinese) [范镜泓 2008 材料变形与破坏的多尺度分析 (北京: 科学出版社) 第40-132页]

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Publishing process
  • Received Date:  23 December 2014
  • Accepted Date:  31 January 2015
  • Published Online:  05 July 2015

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