Research progress of green chemical mechanical polishing slurry

Gao Pei-Li; Zhang Zhen-Yu; Wang Dong; Zhang Le-Zhen; Xu Guang-Hong; Meng Fan-Ning; Xie Wen-Xiang; Bi Sheng

doi:10.7498/aps.70.20201917

Abstract

Atomic-scale fabrication is an effective way to realize the ultra-smooth surfaces of semiconductor wafers on an atomic scale. As one of the crucial manufacturing means for atomically precise surface of large-sized functional materials, chemical mechanical polishing (CMP) has become a key technology for ultra-smooth and non-damage surface planarization of advanced materials and devices by virtue of the synergetic effect of chemical corrosion and mechanical grinding. It has been widely used in aviation, aerospace, microelectronics, and many other fields. However, in order to achieve ultra-smooth surface processing at an atomic level, chemical corrosion and mechanical grinding methods commonly used in CMP process require some highly corrosive and toxic hazardous chemicals, which would cause irreversible damage to the ecosystems. Therefore, the recently reported green chemical additives used in high-performance and environmentally friendly CMP slurry for processing atomically precise surface are summarized here in this paper. Moreover, the mechanism of chemical reagents to the modulation of materials surface properties in the CMP process is also analyzed in detail. This will provide a reference for improving the surface characteristics on an atomic scale. Finally, the challenges that the polishing slurry is facing in the research of atomic-scale processing are put forward, and their future development directions are prospected too, which has profound practical significance for further improving the atomic-scale surface accuracy.

Keywords:

Authors and contacts

1.
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Institute of High Performance Manufacturing, Dalian University of Technology, Dalian 116024, China
2.
Beijing Spacecrafts, China Academy of Space Technology, Beijing 100094, China
3.
Weichai Power Co., Ltd., Weifang 261061, China

Corresponding author: Zhang Zhen-Yu, zzy@dlut.edu.cn

Funds: Project supported by the National Key R&D Program of China (Grant No. 2018YFA0703400)

FullText HTML : translate this paragraph

References

[1]	Liao Z R, Abdelhafeez A, Li H N, Yang Y, Diaz O Z, Axinte D 2019 Int. J. Mach. Tools Manuf. 143 63 Google Scholar
[2]	Chappert C, Bernas H, Ferre J, Kottler V, Jamet J P, Chen Y, Cambril E, Devolder T, Rousseaux F, Mathet V, Launois H 1998 Science 280 1919 Google Scholar
[3]	Krishnan M, Nalaskowski J W, Cook L M 2010 Chem. Rev. 110 178 Google Scholar
[4]	Zhong Z W 2020 Int. J. Adv. Manuf. Technol. 109 1419 Google Scholar
[5]	Frank B, Kahl P, Podbiel D, Spektor G, Orenstein M, Fu L, Weiss T, Hoegen M H, Davis T J, zu Heringdorf F J M 2017 Sci. Adv. 3 1700721 Google Scholar
[6]	Nagpal P, Lindquist N C, Oh S H, Norris D J 2009 Science 325 594 Google Scholar
[7]	Zhang S J, Zhou Y P, Zhang H J, Xiong Z W, To S 2019 Int. J. Mach. Tools Manuf. 142 16 Google Scholar
[8]	Guo X G, Yuan S, Huang J X, Chen C, Kang R K, Jin Z J, Guo D M 2020 Appl. Surf. Sci. 505 144610 Google Scholar
[9]	Yuan S, Guo X G, Huang J X, Gou Y J, Jin Z J, Kang R K, Guo D M 2020 Tribol. Int. 148 106308 Google Scholar
[10]	Qin C J, Hu Z H, Tang A M, Yang Z P, Luo S 2020 Wear 452–453 203293 Google Scholar
[11]	Zhang Z F, Yan W X, Zhang L, Liu W L, Song Z T 2011 Microelectron. Eng. 88 3020 Google Scholar
[12]	Xu W H, Cheng Y Y, Zhong M 2019 Microelectron. Eng. 216 111029 Google Scholar
[13]	Werrell J M, Mandal S, Thomas E L H, Brousseau E B, Lewis R, Borri P, Davies P R, Williams O A 2017 Sci. Technol. Adv. Mater. 18 654 Google Scholar
[14]	Lin Z C, Wang R Y, Ma S H 2018 Tribol. Int. 117 119 Google Scholar
[15]	Sanusi N F A M, Yusoff M H M, Seng O B, Marzuki M S, Abdullah A Z 2018 J. Membr. Sci. 548 232 Google Scholar
[16]	Oh M H, Nho J S, Cho S B, Lee J S, Singh R K 2011 Powder Technol. 206 239 Google Scholar
[17]	Zhou Y, Pan G S, Shi X L, Xu L, Zou C L, Gong H, Luo G H 2014 Appl. Surf. Sci. 316 643 Google Scholar
[18]	Ballarin N, Carraro C, Maboudian R, Magagnin L 2014 Electrochem. Commun. 40 17 Google Scholar
[19]	Wysocki B, Idaszek J, Buhagiar J, Szlazak K, Brynk T, Kurzydlowski K J, Swieszkowski W 2019 Mater. Sci. Eng., C 95 428 Google Scholar
[20]	Liu J W, Jiang L, Wu H Q, Zhao T, Qian L M 2020 J. Electrochem. Soc. 167 131502 Google Scholar
[21]	Yin D, Yang L, Ma T D, Xu Y, Tan B M, Yang F, Sun X Q, Liu M R 2020 Mater. Chem. Phys. 252 123230 Google Scholar
[22]	Pang R, Zhang X L 2019 J. Cleaner Prod. 233 84 Google Scholar
[23]	Xiong X Q, Ma Q R, Yuan Y Y, Wu Z H, Zhang M 2020 J. Cleaner Prod. 267 121957 Google Scholar
[24]	Mandal S, Thomas E L H, Gines L, Morgan D, Green J, Brousseau E B, Williams O A 2018 Carbon 130 25 Google Scholar
[25]	Jiang L, He Y Y, Luo J B 2014 Tribol. Lett. 56 327 Google Scholar
[26]	Hazarika J, Rajaraman P V 2020 ECS J. Solid State Sci. Technol. 9 024008 Google Scholar
[27]	Zhang M, Oh J K, Huang S Y, Lin Y R, Liu Y, Mannan M S, Cisneros-Zevallos L, Akbulut M 2015 J. Food Eng. 161 8 Google Scholar
[28]	Gottselig S M, Dunn-Horrocks S L, Woodring K S, Coufal C D, Tri D 2016 J. Poult. Sci. 95 1356 Google Scholar
[29]	Zhang Z Y, Liao L X, Wang X Z, Xie W X, Guo D M 2020 Appl. Surf. Sci. 506 144670 Google Scholar
[30]	Zhang Z Y, Cui J F, Zhang J B, Liu D D, Yu Z J, Guo D M 2019 Appl. Surf. Sci. 467–468 5 Google Scholar
[31]	Zhang Z Y, Wang B, Zhou P, Kang R K, Zhang B, Guo D M 2016 Sci. Rep. 6 26891 Google Scholar
[32]	Zhang Z Y, Wang B, Zhou P, Guo D M, Kang R K, Zhang B 2016 Sci. Rep. 6 22466 Google Scholar
[33]	Xie W X, Zhang Z Y, Liao L X, Liu J, Su H J, Wang S D, Guo D M 2020 Nanoscale 12 22518 Google Scholar
[34]	Liao L X, Zhang Z Y, Liu J, Li Y B, Cui X X, Liu L 2020 J. Manuf. Processes 59 51 Google Scholar
[35]	Xue D B, Wang P, Jiao L Y, Li W H, Ji Y Q 2019 Appl. Opt. 58 1950 Google Scholar
[36]	Wang H B, Song Z T, Liu W L, Kong H 2011 Microelectron. Eng. 88 1010 Google Scholar
[37]	Li T, Sun H Y, Wang D Q, Huang J T, Li D D, Lei F, Sun D Z 2021 Appl. Surf. Sci. 537 147859 Google Scholar
[38]	Guo X G, Huang J X, Yuan S, Chen C, Jin Z J, Kang R K, Guo D M 2020 Appl. Surf. Sci. 501 144170 Google Scholar
[39]	Kawaguchi K, Ito H, Kuwahara T, Higuchi Y, Ozawa N, Kubo M 2016 ACS Appl. Mater. Interfaces 8 11830 Google Scholar
[40]	Wen J L, Ma T B, Zhang W W, van Duin A C T, Lu X C 2017 Comput. Mater. Sci. 131 230 Google Scholar
[41]	Sagi K V, Amanapu H P, Alety S R, Babu S V 2016 ECS J. Solid State Sci. Technol. 5 256 Google Scholar
[42]	Yuan Z W, Jin Z J, Zhang Y J, Wen Q 2013 J. Manuf. Sci. Eng. 135 041006 Google Scholar
[43]	倪自丰, 陈国美, 徐来军, 白亚雯, 李庆忠, 赵永武 2018 机械工程学报 54 19 Google Scholar Ni Z F, Chen G M, Xu L J, Bai Y W, Li Q Z, Zhao Y W 2018 Chin. J. Mech. Eng. 54 19 Google Scholar
[44]	Sagi K V, Teugels L G, van der Veen M H, Struyf H, Babu S V 2017 ECS J. Solid State Sci. Technol. 6 P259 Google Scholar
[45]	Cimen Y, Akyuz S, Turk H 2015 New J. Chem. 39 3894 Google Scholar
[46]	Feng D H, Wang W L, Liu W L, Song Z T 2020 ECS J. Solid State Sci. Technol. 9 074003 Google Scholar
[47]	Piñeiro A, Black A, Medina J, Dieguez E, Parra V 2013 Wear 303 446 Google Scholar
[48]	Uneda M, Fujii K 2020 Precis. Eng. 64 91 Google Scholar
[49]	Deng J Y, Lu J B, Yan Q S, Pan J S 2020 Diamond Relat. Mater. 111 108147 Google Scholar
[50]	Yang X, Sun R Y, Kawai K, Arima K, Yamamura K 2019 ACS Appl. Mater. Interfaces 11 2535 Google Scholar
[51]	Ou L W, Wang Y H, Hu H Q, Zhang L L, Dong Z G, Kang R K, Guo D M, Shi K 2019 Precis. Eng. 55 14 Google Scholar
[52]	Penta N K, Veera P R, Babu S V 2011 ACS Appl. Mater. Interfaces 3 4126 Google Scholar
[53]	Guo J, Gong J, Shi P F, Xiao C, Jiang L, Chen L, Qian L M 2020 Tribol. Int. 150 106370 Google Scholar
[54]	Nelabhotla D M, Jayaraman T V, Asghar K, Das D 2016 Mater. Des. 104 392 Google Scholar
[55]	Pan B, Kang R K, Guo J, Fu H Y, Du D X, Kong J X 2019 J. Manuf. Processes 44 47 Google Scholar
[56]	Kwon O, Bae K, Byun J, Lim T, Kim J J 2020 Microelectron. Eng. 227 111308 Google Scholar
[57]	Mao M J, Chen W T, Liu J L, Hu Z H, Qin C J 2020 Int. J. Refract. Met. Hard Mater. 88 105179 Google Scholar
[58]	Sharma P P, Suni I, Brands M, Li Y Z 2010 Electrochem. Solid-State Lett. 13 H416 Google Scholar
[59]	Lee D, Kim H, Pak B, Kim D, Jeong H, Lee H 2017 J. Frict. Wear 38 482 Google Scholar
[60]	Wan C C, Jiang S J, You M T, Sahayam A C 2005 J. Anal. At. Spectrom. 20 1290 Google Scholar
[61]	Thomas E L H, Nelson G W, Mandal S, Foord J S, Williams O A 2014 Carbon 68 473 Google Scholar
[62]	Shi Z Y, Jin Z J, Guo X G, Yuan S, Guo J 2019 Comput. Mater. Sci. 166 136 Google Scholar
[63]	Chen G P, Li J G, Long J Y, Luo H M, Zhou Y, Xie X Z, Pan G S 2020 Appl. Surf. Sci. 15 147963 Google Scholar
[64]	Chen G M, Ni Z F, Xu L J, Li Q Z, Zhao Y W 2015 Appl. Surf. Sci. 359 664 Google Scholar
[65]	Dong Y, Lei H, Liu W Q, Chen Y 2019 J. Alloys Compd. 777 1294 Google Scholar
[66]	Shao S, Wu B B, Wang P, He P, Qu X P 2020 Appl. Surf. Sci. 506 144976 Google Scholar
[67]	Wang Q, Yin D, Gao B H, Tian S Y, Sun X Q, Liu M R, Zhang S H, Tan B M 2020 Colloids Surf., A 586 124286 Google Scholar
[68]	Wu H Q, Jiang L, Liu J W, Deng C B, Huang H F, Qian L M 2020 Tribol. Lett. 68 34 Google Scholar
[69]	Zhou J K, Niu X H, Cui Y Q, Wang Z, Wang J C, Wang R 2020 Appl. Surf. Sci. 505 144507 Google Scholar
[70]	Jiang L, Lan Y Q, He Y Y, Li Y, Li Y Z, Luo J B 2014 Thin Solid Films 556 395 Google Scholar
[71]	Hu L J, Pan G F, Wang H, Zhang X B, Wang Z Y, Zhu T T 2020 Mater. Chem. Phys. 256 123672 Google Scholar
[72]	Kumar D, Jain V, Rai B 2018 Corros. Sci. 142 102 Google Scholar
[73]	Rani B E A, Basu B B J 2012 Int. J. Corros. 2012 380217 Google Scholar
[74]	Al-Amiery A A, Binti Kassim F A, Kadhum A A, Mohamad A B 2016 Sci. Rep. 6 19890 Google Scholar
[75]	Matsuda T, Takahashi H, Tsurugaya M, Miyazaki K, Doy T K, Kinoshita M 2003 J. Electrochem. Soc. 150 532 Google Scholar
[76]	Chandrasekaran N, Ramarajan S, Lee W, Sabde G M, Meikle S 2004 J. Electrochem. Soc. 151 G882 Google Scholar
[77]	Seo Y J, Kim S Y, Choi Y O, Oh Y T, Lee W S 2004 Mater. Lett. 58 2091 Google Scholar
[78]	Rahman M N A, Yusuf Y, Mansor M, Shuhaimi A 2016 Appl. Surf. Sci. 362 572 Google Scholar
[79]	Shi K W, Kar Y B, Talik N A, Yew L W 2017 Proc. Eng. 184 360 Google Scholar
[80]	Pan G S, Wang N, Gong H, Liu Y 2012 Tribol. Int. 47 142 Google Scholar
[81]	Yang G, He P, Qu X P 2018 Appl. Surf. Sci. 427 148 Google Scholar
[82]	Zhou J K, Niu X H, Wang Z, Cui Y Q, Wang J C, Yang C H, Huo Z Q, Wang R 2020 Colloids Surf., A 586 124293 Google Scholar
[83]	Li J, Lu X C, Zhang Z B 2014 3rd International Conference on Machine Design and Manufacturing Engineering (ICMDME) South Korea, May 24–25, 2014 p74
[84]	Muniz-Miranda M, Muniz-Miranda F, Caporali S 2014 Beilstein J. Nanotechnol. 5 2489 Google Scholar
[85]	Zhang W Q, Liu Y L, Wang C W, Niu X H, Ji J, Du Y C, Han L N 2017 ECS J. Solid State Sci. Technol. 6 786 Google Scholar
[86]	Ma T D, Tan B M, Xu Y, Yin D, Liu G R, Zeng N Y, Song G Q, Kao Z X, Liu Y L 2020 Colloids Surf., A 599 124872 Google Scholar
[87]	Hu L J, Pan G F, Wang H, Xu Y, Wang R 2020 Colloids Surf., A 603 125275 Google Scholar
[88]	Zhang L F, Wang T Q, Lu X C 2019 Microelectron. Eng. 216 111090 Google Scholar
[89]	Seo E B, Park J G, Bae J Y, Park J H 2020 J. Korean Phys. Soc. 76 1127 Google Scholar
[90]	Ilie F, Ipate G 2020 Int. J. Surf. Sci. Eng. 14 105 Google Scholar
[91]	Guo X G, Yuan S, Gou Y J, Wang X L, Guo J, Jin Z J, Kang R K 2020 Appl. Surf. Sci. 508 145262 Google Scholar
[92]	Xu A X, Liu W L, Zhao G Y, Feng D H, Wang W L, Song Z T 2020 ECS J. Solid State Sci. Technol. 9 044007 Google Scholar
[93]	Zhou J K, Niu X H, Yang C H, Huo Z Q, Lu Y N, Wang Z, Cui Y Q, Wang R 2020 Appl. Surf. Sci. 529 147109 Google Scholar
[94]	Wen J L, Ma T B, Zhang W W, van Duin A C T, van Duin D M, Hu Y Z, Lu X C 2019 J. Phys. Chem. C 123 26467 Google Scholar
[95]	Zhang R, Somasundaran P 2006 Adv. Colloid Interface Sci. 123 213 Google Scholar
[96]	Xiao L, Xu G Y, Zhang Z Q, Wang Y B, Li G Z 2003 Colloids Surf., A 224 199 Google Scholar
[97]	Pethica B A 1977 J. Colloid Interface Sci. 62 567 Google Scholar
[98]	Asghar K, Qasim M, Nelabhotla D M, Das D 2016 Colloids Surf., A 497 133 Google Scholar
[99]	Wang X, Lei H, Chen R L 2017 Precis. Eng. 50 263 Google Scholar
[100]	Lee Y, Seo Y J, Lee H, Jeong H 2016 Int. J. Precis. Eng. Manuf. 3 13 Google Scholar
[101]	Zhang Z F, Liu W L, Song Z T 2010 Appl. Opt. 49 5480 Google Scholar
[102]	Palla B J, Shah D O 2000 J. Colloid Interface Sci. 223 102 Google Scholar
[103]	Seo D, Schrader A M, Chen S Y, Kaufman Y, Cristiani T R, Page S H, Koenig P H, Gizaw Y, Lee D W, Israelachvili J N 2018 Proc. Natl. Acad. Sci. U.S.A. 115 8070 Google Scholar
[104]	Zhang W G, Liu Y L, Wang C W, Niu X H, Han L N, Ji J, Du Y C 2018 Microelectronics 48 421 Google Scholar
[105]	Choi I C, Kim H T, Yerriboina N P, Lee J H, Teugels, L, Kim T G, Park J G 2019 ECS J. Solid State Sci. Technol. 8 3028 Google Scholar
[106]	Li Y L, Liu Y L, Wang C W, Li Y 2016 J. Semicond. 37 086001 Google Scholar
[107]	Luan X D, Liu Y L, Zhang B G, Wang S L, Niu X H, Wang C W, Wang J 2017 Microelectron. Eng. 170 21 Google Scholar
[108]	Parthiban P, Das D 2019 ECS J. Solid State Sci. Technol. 8 3106 Google Scholar
[109]	Tang J Y, Liu Y L, Wang C W, Niu X H, Tan B M, Gao B H 2018 Microelectron. Eng. 202 1 Google Scholar
[110]	Yin D, Tian S Y, Zhang N N, Wang Q, Sun X Q, Liu M R, Zhang S H, Tan B M 2021 Mater. Chem. Phys. 257 123841 Google Scholar
[111]	王建超, 刘玉玲, 牛新欢, 杨盛华, 张凯, 周家凯, 张辉辉 2018 电镀与涂饰 37 1119 Google Scholar Wang J C, Liu Y L, Niu X H, Yang S H, Zhang K, Zhou J K, Zhang H H 2018 Electroplat. Finish. 37 1119 Google Scholar
[112]	Hong J, Niu X H, Liu Y L, Wang C W, Zhang B G, Sun M, Wang J, Han L Y, Zhang W Q 2017 Microelectron. Eng. 168 76 Google Scholar
[113]	Xu Y C, Lu J, Xu X P 2019 Catalysts 9 594 Google Scholar
[114]	Yu X, Zhang B G, Wang R, Kao Z X, Yang S H, Wei W 2021 Mater. Sci. Semicond. Process. 121 105387 Google Scholar
[115]	Yuan Z W, He Y, Sun X W, Wen Q 2018 Mater. Manuf. Processes 33 1214 Google Scholar
[116]	Wang J, Wang T Q, Pan G S, Lu X C 2016 Appl. Surf. Sci. 378 130 Google Scholar
[117]	Zhang L, Zhang B G, Pan B C, Wang C W 2017 Appl. Surf. Sci. 422 247 Google Scholar
[118]	Zhang L F, Deng H 2020 Appl. Surf. Sci. 514 145957 Google Scholar
[119]	Xu W H, Lu X C, Pan G S, Lei Y Z, Luo J B 2010 Appl. Surf. Sci. 256 3936 Google Scholar
[120]	Zhong M, Yuan R J, Li X B, Chen J F, Xu W H 2018 Surf. Eng. 31 1007 Google Scholar

Cited By

图 1 CMP系统示意图

Figure 1. Diagram of CMP system.

DownLoad: Full-Size Img PowerPoint

图 2 不同H₂O₂浓度下铝合金基底的氧化和腐蚀过程示意图^[37]

Figure 2. Schematic diagram for the oxidation and corrosion processes of substrates with various H₂O₂ concentration^[37].

DownLoad: Full-Size Img PowerPoint

图 3 (a) 利用臭氧气体发生器产生的含气泡的强化浆料对SiC衬底的CMP方法示意图^[48]; (b) 基于电芬顿反应的6H-SiC单晶增强CMP法原理图^[49]; (c) 氯化钠水溶液阳极氧化装置示意图^[50]; (d) 光化学辅助CMP示意图^[51]

Figure 3. (a) Illustration of proposed CMP method of SiC substrate by enhanced slurry containing bubbles enclosing ozone gas generated by ozone gas generator^[48]; (b) schematic diagram of enhanced CMP method for single-crystal 6H-SiC based on electro-Fenton reaction^[49]; (c) schematic diagram of anodic oxidation setup with sodium chloride aqueous solution^[50]; (d) schematic diagram of photochemically combined CMP process^[51].

DownLoad: Full-Size Img PowerPoint

图 4 研制的优化CMP浆料的CMP机理示意图^[29]

Figure 4. Schematic diagram of the CMP mechanism for the developed optimal CMP slurry^[29].

DownLoad: Full-Size Img PowerPoint

图 5 (a) 具有阻挡层的Cu互连线的抛光过程; (b) CMP加工后具有的典型的碟状结构图形^[70]; (c) 电偶腐蚀的示意图^[71]

Figure 5. (a) Schematic of the CMP process of Cu interconnect with a barrier; (b) typical dishing profiles of the pattern feature after CMP process^[70]; (c) schematic diagram of galvanic corrosion^[71].

DownLoad: Full-Size Img PowerPoint

图 6 离子(a)和非离子(b)表面活性剂对高离子强度泥浆稳定性的影响; (c) 阴离子和非离子表面活性剂协同混合的高离子强度浆料稳定机理^[102]

Figure 6. Effects of ionic (a) and nonionic (b) surfactant addition on the stability of high ionic strength slurries; (c) mechanism of high ionic strength slurry stabilization by the synergistic mixture of anionic and nonionic surfactants^[102].

DownLoad: Full-Size Img PowerPoint

图 7 表面活性剂在液-汽界面和液-固界面的分布示意图　(a) 阳离子表面活性剂; (b) 非离子表面活性剂; (c) 阴离子表面活性剂^[103]

Figure 7. Schematics of how the surfactants are partitioned on the liquid-vapor and liquid-solid interfaces: (a) Cationic surfactants; (b) nonionic surfactants; (c) anionic surfactants^[103]

DownLoad: Full-Size Img PowerPoint

图 8 (a) 污染的图案化晶圆SEM图像(左)以及污染(中间)和清洁(右)的晶圆表面缺陷图^[107]; (b) 污染(左)和清洁(右)的铜样品AFM图像^[88]

Figure 8. (a) SEM images (left) of contaminated patterned wafer and the defect map on contaminated (centre) and cleaned (right) wafer surface^[107]; (b) AFM images of contaminated (left) and cleaned (right) Cu sample^[88].

DownLoad: Full-Size Img PowerPoint

[1]	Liao Z R, Abdelhafeez A, Li H N, Yang Y, Diaz O Z, Axinte D 2019 Int. J. Mach. Tools Manuf. 143 63 Google Scholar
[2]	Chappert C, Bernas H, Ferre J, Kottler V, Jamet J P, Chen Y, Cambril E, Devolder T, Rousseaux F, Mathet V, Launois H 1998 Science 280 1919 Google Scholar
[3]	Krishnan M, Nalaskowski J W, Cook L M 2010 Chem. Rev. 110 178 Google Scholar
[4]	Zhong Z W 2020 Int. J. Adv. Manuf. Technol. 109 1419 Google Scholar
[5]	Frank B, Kahl P, Podbiel D, Spektor G, Orenstein M, Fu L, Weiss T, Hoegen M H, Davis T J, zu Heringdorf F J M 2017 Sci. Adv. 3 1700721 Google Scholar
[6]	Nagpal P, Lindquist N C, Oh S H, Norris D J 2009 Science 325 594 Google Scholar
[7]	Zhang S J, Zhou Y P, Zhang H J, Xiong Z W, To S 2019 Int. J. Mach. Tools Manuf. 142 16 Google Scholar
[8]	Guo X G, Yuan S, Huang J X, Chen C, Kang R K, Jin Z J, Guo D M 2020 Appl. Surf. Sci. 505 144610 Google Scholar
[9]	Yuan S, Guo X G, Huang J X, Gou Y J, Jin Z J, Kang R K, Guo D M 2020 Tribol. Int. 148 106308 Google Scholar
[10]	Qin C J, Hu Z H, Tang A M, Yang Z P, Luo S 2020 Wear 452–453 203293 Google Scholar
[11]	Zhang Z F, Yan W X, Zhang L, Liu W L, Song Z T 2011 Microelectron. Eng. 88 3020 Google Scholar
[12]	Xu W H, Cheng Y Y, Zhong M 2019 Microelectron. Eng. 216 111029 Google Scholar
[13]	Werrell J M, Mandal S, Thomas E L H, Brousseau E B, Lewis R, Borri P, Davies P R, Williams O A 2017 Sci. Technol. Adv. Mater. 18 654 Google Scholar
[14]	Lin Z C, Wang R Y, Ma S H 2018 Tribol. Int. 117 119 Google Scholar
[15]	Sanusi N F A M, Yusoff M H M, Seng O B, Marzuki M S, Abdullah A Z 2018 J. Membr. Sci. 548 232 Google Scholar
[16]	Oh M H, Nho J S, Cho S B, Lee J S, Singh R K 2011 Powder Technol. 206 239 Google Scholar
[17]	Zhou Y, Pan G S, Shi X L, Xu L, Zou C L, Gong H, Luo G H 2014 Appl. Surf. Sci. 316 643 Google Scholar
[18]	Ballarin N, Carraro C, Maboudian R, Magagnin L 2014 Electrochem. Commun. 40 17 Google Scholar
[19]	Wysocki B, Idaszek J, Buhagiar J, Szlazak K, Brynk T, Kurzydlowski K J, Swieszkowski W 2019 Mater. Sci. Eng., C 95 428 Google Scholar
[20]	Liu J W, Jiang L, Wu H Q, Zhao T, Qian L M 2020 J. Electrochem. Soc. 167 131502 Google Scholar
[21]	Yin D, Yang L, Ma T D, Xu Y, Tan B M, Yang F, Sun X Q, Liu M R 2020 Mater. Chem. Phys. 252 123230 Google Scholar
[22]	Pang R, Zhang X L 2019 J. Cleaner Prod. 233 84 Google Scholar
[23]	Xiong X Q, Ma Q R, Yuan Y Y, Wu Z H, Zhang M 2020 J. Cleaner Prod. 267 121957 Google Scholar
[24]	Mandal S, Thomas E L H, Gines L, Morgan D, Green J, Brousseau E B, Williams O A 2018 Carbon 130 25 Google Scholar
[25]	Jiang L, He Y Y, Luo J B 2014 Tribol. Lett. 56 327 Google Scholar
[26]	Hazarika J, Rajaraman P V 2020 ECS J. Solid State Sci. Technol. 9 024008 Google Scholar
[27]	Zhang M, Oh J K, Huang S Y, Lin Y R, Liu Y, Mannan M S, Cisneros-Zevallos L, Akbulut M 2015 J. Food Eng. 161 8 Google Scholar
[28]	Gottselig S M, Dunn-Horrocks S L, Woodring K S, Coufal C D, Tri D 2016 J. Poult. Sci. 95 1356 Google Scholar
[29]	Zhang Z Y, Liao L X, Wang X Z, Xie W X, Guo D M 2020 Appl. Surf. Sci. 506 144670 Google Scholar
[30]	Zhang Z Y, Cui J F, Zhang J B, Liu D D, Yu Z J, Guo D M 2019 Appl. Surf. Sci. 467–468 5 Google Scholar
[31]	Zhang Z Y, Wang B, Zhou P, Kang R K, Zhang B, Guo D M 2016 Sci. Rep. 6 26891 Google Scholar
[32]	Zhang Z Y, Wang B, Zhou P, Guo D M, Kang R K, Zhang B 2016 Sci. Rep. 6 22466 Google Scholar
[33]	Xie W X, Zhang Z Y, Liao L X, Liu J, Su H J, Wang S D, Guo D M 2020 Nanoscale 12 22518 Google Scholar
[34]	Liao L X, Zhang Z Y, Liu J, Li Y B, Cui X X, Liu L 2020 J. Manuf. Processes 59 51 Google Scholar
[35]	Xue D B, Wang P, Jiao L Y, Li W H, Ji Y Q 2019 Appl. Opt. 58 1950 Google Scholar
[36]	Wang H B, Song Z T, Liu W L, Kong H 2011 Microelectron. Eng. 88 1010 Google Scholar
[37]	Li T, Sun H Y, Wang D Q, Huang J T, Li D D, Lei F, Sun D Z 2021 Appl. Surf. Sci. 537 147859 Google Scholar
[38]	Guo X G, Huang J X, Yuan S, Chen C, Jin Z J, Kang R K, Guo D M 2020 Appl. Surf. Sci. 501 144170 Google Scholar
[39]	Kawaguchi K, Ito H, Kuwahara T, Higuchi Y, Ozawa N, Kubo M 2016 ACS Appl. Mater. Interfaces 8 11830 Google Scholar
[40]	Wen J L, Ma T B, Zhang W W, van Duin A C T, Lu X C 2017 Comput. Mater. Sci. 131 230 Google Scholar
[41]	Sagi K V, Amanapu H P, Alety S R, Babu S V 2016 ECS J. Solid State Sci. Technol. 5 256 Google Scholar
[42]	Yuan Z W, Jin Z J, Zhang Y J, Wen Q 2013 J. Manuf. Sci. Eng. 135 041006 Google Scholar
[43]	倪自丰, 陈国美, 徐来军, 白亚雯, 李庆忠, 赵永武 2018 机械工程学报 54 19 Google Scholar Ni Z F, Chen G M, Xu L J, Bai Y W, Li Q Z, Zhao Y W 2018 Chin. J. Mech. Eng. 54 19 Google Scholar
[44]	Sagi K V, Teugels L G, van der Veen M H, Struyf H, Babu S V 2017 ECS J. Solid State Sci. Technol. 6 P259 Google Scholar
[45]	Cimen Y, Akyuz S, Turk H 2015 New J. Chem. 39 3894 Google Scholar
[46]	Feng D H, Wang W L, Liu W L, Song Z T 2020 ECS J. Solid State Sci. Technol. 9 074003 Google Scholar
[47]	Piñeiro A, Black A, Medina J, Dieguez E, Parra V 2013 Wear 303 446 Google Scholar
[48]	Uneda M, Fujii K 2020 Precis. Eng. 64 91 Google Scholar
[49]	Deng J Y, Lu J B, Yan Q S, Pan J S 2020 Diamond Relat. Mater. 111 108147 Google Scholar
[50]	Yang X, Sun R Y, Kawai K, Arima K, Yamamura K 2019 ACS Appl. Mater. Interfaces 11 2535 Google Scholar
[51]	Ou L W, Wang Y H, Hu H Q, Zhang L L, Dong Z G, Kang R K, Guo D M, Shi K 2019 Precis. Eng. 55 14 Google Scholar
[52]	Penta N K, Veera P R, Babu S V 2011 ACS Appl. Mater. Interfaces 3 4126 Google Scholar
[53]	Guo J, Gong J, Shi P F, Xiao C, Jiang L, Chen L, Qian L M 2020 Tribol. Int. 150 106370 Google Scholar
[54]	Nelabhotla D M, Jayaraman T V, Asghar K, Das D 2016 Mater. Des. 104 392 Google Scholar
[55]	Pan B, Kang R K, Guo J, Fu H Y, Du D X, Kong J X 2019 J. Manuf. Processes 44 47 Google Scholar
[56]	Kwon O, Bae K, Byun J, Lim T, Kim J J 2020 Microelectron. Eng. 227 111308 Google Scholar
[57]	Mao M J, Chen W T, Liu J L, Hu Z H, Qin C J 2020 Int. J. Refract. Met. Hard Mater. 88 105179 Google Scholar
[58]	Sharma P P, Suni I, Brands M, Li Y Z 2010 Electrochem. Solid-State Lett. 13 H416 Google Scholar
[59]	Lee D, Kim H, Pak B, Kim D, Jeong H, Lee H 2017 J. Frict. Wear 38 482 Google Scholar
[60]	Wan C C, Jiang S J, You M T, Sahayam A C 2005 J. Anal. At. Spectrom. 20 1290 Google Scholar
[61]	Thomas E L H, Nelson G W, Mandal S, Foord J S, Williams O A 2014 Carbon 68 473 Google Scholar
[62]	Shi Z Y, Jin Z J, Guo X G, Yuan S, Guo J 2019 Comput. Mater. Sci. 166 136 Google Scholar
[63]	Chen G P, Li J G, Long J Y, Luo H M, Zhou Y, Xie X Z, Pan G S 2020 Appl. Surf. Sci. 15 147963 Google Scholar
[64]	Chen G M, Ni Z F, Xu L J, Li Q Z, Zhao Y W 2015 Appl. Surf. Sci. 359 664 Google Scholar
[65]	Dong Y, Lei H, Liu W Q, Chen Y 2019 J. Alloys Compd. 777 1294 Google Scholar
[66]	Shao S, Wu B B, Wang P, He P, Qu X P 2020 Appl. Surf. Sci. 506 144976 Google Scholar
[67]	Wang Q, Yin D, Gao B H, Tian S Y, Sun X Q, Liu M R, Zhang S H, Tan B M 2020 Colloids Surf., A 586 124286 Google Scholar
[68]	Wu H Q, Jiang L, Liu J W, Deng C B, Huang H F, Qian L M 2020 Tribol. Lett. 68 34 Google Scholar
[69]	Zhou J K, Niu X H, Cui Y Q, Wang Z, Wang J C, Wang R 2020 Appl. Surf. Sci. 505 144507 Google Scholar
[70]	Jiang L, Lan Y Q, He Y Y, Li Y, Li Y Z, Luo J B 2014 Thin Solid Films 556 395 Google Scholar
[71]	Hu L J, Pan G F, Wang H, Zhang X B, Wang Z Y, Zhu T T 2020 Mater. Chem. Phys. 256 123672 Google Scholar
[72]	Kumar D, Jain V, Rai B 2018 Corros. Sci. 142 102 Google Scholar
[73]	Rani B E A, Basu B B J 2012 Int. J. Corros. 2012 380217 Google Scholar
[74]	Al-Amiery A A, Binti Kassim F A, Kadhum A A, Mohamad A B 2016 Sci. Rep. 6 19890 Google Scholar
[75]	Matsuda T, Takahashi H, Tsurugaya M, Miyazaki K, Doy T K, Kinoshita M 2003 J. Electrochem. Soc. 150 532 Google Scholar
[76]	Chandrasekaran N, Ramarajan S, Lee W, Sabde G M, Meikle S 2004 J. Electrochem. Soc. 151 G882 Google Scholar
[77]	Seo Y J, Kim S Y, Choi Y O, Oh Y T, Lee W S 2004 Mater. Lett. 58 2091 Google Scholar
[78]	Rahman M N A, Yusuf Y, Mansor M, Shuhaimi A 2016 Appl. Surf. Sci. 362 572 Google Scholar
[79]	Shi K W, Kar Y B, Talik N A, Yew L W 2017 Proc. Eng. 184 360 Google Scholar
[80]	Pan G S, Wang N, Gong H, Liu Y 2012 Tribol. Int. 47 142 Google Scholar
[81]	Yang G, He P, Qu X P 2018 Appl. Surf. Sci. 427 148 Google Scholar
[82]	Zhou J K, Niu X H, Wang Z, Cui Y Q, Wang J C, Yang C H, Huo Z Q, Wang R 2020 Colloids Surf., A 586 124293 Google Scholar
[83]	Li J, Lu X C, Zhang Z B 2014 3rd International Conference on Machine Design and Manufacturing Engineering (ICMDME) South Korea, May 24–25, 2014 p74
[84]	Muniz-Miranda M, Muniz-Miranda F, Caporali S 2014 Beilstein J. Nanotechnol. 5 2489 Google Scholar
[85]	Zhang W Q, Liu Y L, Wang C W, Niu X H, Ji J, Du Y C, Han L N 2017 ECS J. Solid State Sci. Technol. 6 786 Google Scholar
[86]	Ma T D, Tan B M, Xu Y, Yin D, Liu G R, Zeng N Y, Song G Q, Kao Z X, Liu Y L 2020 Colloids Surf., A 599 124872 Google Scholar
[87]	Hu L J, Pan G F, Wang H, Xu Y, Wang R 2020 Colloids Surf., A 603 125275 Google Scholar
[88]	Zhang L F, Wang T Q, Lu X C 2019 Microelectron. Eng. 216 111090 Google Scholar
[89]	Seo E B, Park J G, Bae J Y, Park J H 2020 J. Korean Phys. Soc. 76 1127 Google Scholar
[90]	Ilie F, Ipate G 2020 Int. J. Surf. Sci. Eng. 14 105 Google Scholar
[91]	Guo X G, Yuan S, Gou Y J, Wang X L, Guo J, Jin Z J, Kang R K 2020 Appl. Surf. Sci. 508 145262 Google Scholar
[92]	Xu A X, Liu W L, Zhao G Y, Feng D H, Wang W L, Song Z T 2020 ECS J. Solid State Sci. Technol. 9 044007 Google Scholar
[93]	Zhou J K, Niu X H, Yang C H, Huo Z Q, Lu Y N, Wang Z, Cui Y Q, Wang R 2020 Appl. Surf. Sci. 529 147109 Google Scholar
[94]	Wen J L, Ma T B, Zhang W W, van Duin A C T, van Duin D M, Hu Y Z, Lu X C 2019 J. Phys. Chem. C 123 26467 Google Scholar
[95]	Zhang R, Somasundaran P 2006 Adv. Colloid Interface Sci. 123 213 Google Scholar
[96]	Xiao L, Xu G Y, Zhang Z Q, Wang Y B, Li G Z 2003 Colloids Surf., A 224 199 Google Scholar
[97]	Pethica B A 1977 J. Colloid Interface Sci. 62 567 Google Scholar
[98]	Asghar K, Qasim M, Nelabhotla D M, Das D 2016 Colloids Surf., A 497 133 Google Scholar
[99]	Wang X, Lei H, Chen R L 2017 Precis. Eng. 50 263 Google Scholar
[100]	Lee Y, Seo Y J, Lee H, Jeong H 2016 Int. J. Precis. Eng. Manuf. 3 13 Google Scholar
[101]	Zhang Z F, Liu W L, Song Z T 2010 Appl. Opt. 49 5480 Google Scholar
[102]	Palla B J, Shah D O 2000 J. Colloid Interface Sci. 223 102 Google Scholar
[103]	Seo D, Schrader A M, Chen S Y, Kaufman Y, Cristiani T R, Page S H, Koenig P H, Gizaw Y, Lee D W, Israelachvili J N 2018 Proc. Natl. Acad. Sci. U.S.A. 115 8070 Google Scholar
[104]	Zhang W G, Liu Y L, Wang C W, Niu X H, Han L N, Ji J, Du Y C 2018 Microelectronics 48 421 Google Scholar
[105]	Choi I C, Kim H T, Yerriboina N P, Lee J H, Teugels, L, Kim T G, Park J G 2019 ECS J. Solid State Sci. Technol. 8 3028 Google Scholar
[106]	Li Y L, Liu Y L, Wang C W, Li Y 2016 J. Semicond. 37 086001 Google Scholar
[107]	Luan X D, Liu Y L, Zhang B G, Wang S L, Niu X H, Wang C W, Wang J 2017 Microelectron. Eng. 170 21 Google Scholar
[108]	Parthiban P, Das D 2019 ECS J. Solid State Sci. Technol. 8 3106 Google Scholar
[109]	Tang J Y, Liu Y L, Wang C W, Niu X H, Tan B M, Gao B H 2018 Microelectron. Eng. 202 1 Google Scholar
[110]	Yin D, Tian S Y, Zhang N N, Wang Q, Sun X Q, Liu M R, Zhang S H, Tan B M 2021 Mater. Chem. Phys. 257 123841 Google Scholar
[111]	王建超, 刘玉玲, 牛新欢, 杨盛华, 张凯, 周家凯, 张辉辉 2018 电镀与涂饰 37 1119 Google Scholar Wang J C, Liu Y L, Niu X H, Yang S H, Zhang K, Zhou J K, Zhang H H 2018 Electroplat. Finish. 37 1119 Google Scholar
[112]	Hong J, Niu X H, Liu Y L, Wang C W, Zhang B G, Sun M, Wang J, Han L Y, Zhang W Q 2017 Microelectron. Eng. 168 76 Google Scholar
[113]	Xu Y C, Lu J, Xu X P 2019 Catalysts 9 594 Google Scholar
[114]	Yu X, Zhang B G, Wang R, Kao Z X, Yang S H, Wei W 2021 Mater. Sci. Semicond. Process. 121 105387 Google Scholar
[115]	Yuan Z W, He Y, Sun X W, Wen Q 2018 Mater. Manuf. Processes 33 1214 Google Scholar
[116]	Wang J, Wang T Q, Pan G S, Lu X C 2016 Appl. Surf. Sci. 378 130 Google Scholar
[117]	Zhang L, Zhang B G, Pan B C, Wang C W 2017 Appl. Surf. Sci. 422 247 Google Scholar
[118]	Zhang L F, Deng H 2020 Appl. Surf. Sci. 514 145957 Google Scholar
[119]	Xu W H, Lu X C, Pan G S, Lei Y Z, Luo J B 2010 Appl. Surf. Sci. 256 3936 Google Scholar
[120]	Zhong M, Yuan R J, Li X B, Chen J F, Xu W H 2018 Surf. Eng. 31 1007 Google Scholar

[1]	Yu Bao-Qing, Xia Bing, Yang Xiao-Yan, Wan Bao-Quan, Zha Jun-Wei. Electric field regulation of polypropylene insulation for high voltage DC cables. Acta Physica Sinica, 2023, 72(6): 068402. doi: 10.7498/aps.72.20222320
[2]	Wang Si-Yuan, Liang Tian-Shou, Shi Peng-Peng. Mechanism of strain-induced magnetic properties changes for metal magnetic memory technology on atomic scale. Acta Physica Sinica, 2022, 71(19): 197502. doi: 10.7498/aps.71.20220745
[3]	Ji Jian-Wei, Kazuya Yamamura, Deng Hui. Plasma-assisted polishing for atomic surface fabrication of single crystal SiC. Acta Physica Sinica, 2021, 70(6): 068102. doi: 10.7498/aps.70.20202014
[4]	Zhang Xin-Zheng, Xia Feng, Xu Jing-Jun. The mechanisms and research progress of laser fabrication technologies beyond diffraction limit. Acta Physica Sinica, 2017, 66(14): 144207. doi: 10.7498/aps.66.144207
[5]	Wu Bo, Zhao Zhe-Ming, Wang Xun-Si, Jang Ling, Mi Nan, Pan Zhang-Hao, Zhang Pei-Qing, Liu Zi-Jun, Nie Qiu-Hua, Dai Shi-Xun. Investigation on Te-based chalcogenide glasses for far-infrared fiber. Acta Physica Sinica, 2017, 66(13): 134208. doi: 10.7498/aps.66.134208
[6]	Li Zong-Bao, Wang Xia, Fan Shuai-Wei. Research of the synergistic effects in Cu/N co-doped TiO2 surface：A DFT calculation. Acta Physica Sinica, 2014, 63(15): 157102. doi: 10.7498/aps.63.157102
[7]	Zhu Shun-Ming, Gu Ran, Huang Shi-Min, Yao Zheng-Grong, Zhang Yang, Chen Bin, Mao Hao-Yuan, Gu Shu-Lin, Ye Jian-Dong, Zheng You-Dou. Influence and mechanism of H2 in the epitaxial growth of ZnO using metal-organic chemical vapor deposition method. Acta Physica Sinica, 2014, 63(11): 118103. doi: 10.7498/aps.63.118103
[8]	Ren Qun, Wang Nan, Zhang Li, Wang Jian-Yuan, Zheng Ya-Ping, Yao Wen-Jing. The effects of spinodal decomposition and nucleation on phase separation. Acta Physica Sinica, 2012, 61(19): 196401. doi: 10.7498/aps.61.196401
[9]	Shao Xuan, Chu Xiao-Liang, Wang Jian, Xu Jin-Ju. Study on effect of wind waves on radar echoes in atmosphere duct oversea. Acta Physica Sinica, 2012, 61(15): 159203. doi: 10.7498/aps.61.159203
[10]	Li Shi-Xiong, Bai Zhong-Chen, Huang Zheng, Zhang Xin, Qin Shui-Jie, Mao Wen-Xue. Study on the machining mechanism of fabrication of micro channels in fused silica substrates by laser-induced plasma. Acta Physica Sinica, 2012, 61(11): 115201. doi: 10.7498/aps.61.115201
[11]	Zhao Cheng-Li, Lü Xiao-Dan, Ning Jian-Ping, Qing You-Min, He Ping-Ni, Gou Fu-Jun. Molecular dynamics simulations of energy effectson atorn F interaction with SiC(100). Acta Physica Sinica, 2011, 60(9): 095203. doi: 10.7498/aps.60.095203
[12]	Lu Guang-Xia, Zhang Hui, Zhang Guo-Ying, Liang Ting, Li Dan, Zhu Sheng-Long. Mechanism of the influence of the interaction between interstitial H atom and doped atom on the dehydrogenation performance of LiNH2. Acta Physica Sinica, 2011, 60(11): 117101. doi: 10.7498/aps.60.117101
[13]	Liu Yuan-Hong, Zhuang Wei-Dong, Gao Wen-Gui, Hu Yun-Sheng, He Tao, He Hua-Qiang. Effect of H3BO3 on preparation and luminescence properties of submicron green-emitting Ca3Sc2Si3O12 ∶Ce phosphor. Acta Physica Sinica, 2010, 59(11): 8200-8204. doi: 10.7498/aps.59.8200
[14]	Li Qi, Fan Guang-Han, Xiong Wei-Ping, Zhang Yong. First-principles calculations of ZnO polar surfaces and N adsorption mechanism. Acta Physica Sinica, 2010, 59(6): 4170-4177. doi: 10.7498/aps.59.4170
[15]	Zhang Yang, Zhang Jian-Hua, Wen Yu-Hua, Zhu Zi-Zhong. The deformation mechanism of nanofilm with void under tensile loading: An atomistic simulation study. Acta Physica Sinica, 2008, 57(11): 7094-7099. doi: 10.7498/aps.57.7094
[16]	. Evolution laws of multi-level atoms interacting with multi-mode cavity fields. Acta Physica Sinica, 2007, 56(12): 6961-6969. doi: 10.7498/aps.56.6961
[17]	Wang Yong-Liang, Zhang Chao, Tang Xin, Zhang Qing-Yu. Influence of interaction between Cu adatoms on the hopping diffusion on Cu(001) surface. Acta Physica Sinica, 2006, 55(8): 4214-4220. doi: 10.7498/aps.55.4214
[18]	Ma Bing-Xian, Jia Yu, Yao Ning, Yang Shi-E, Zhang Bing-Lin. The dynamic control of the templates in selectivity growth from their isomers and the growth mechanism of CVD diamond. Acta Physica Sinica, 2005, 54(9): 4300-4308. doi: 10.7498/aps.54.4300
[19]	Zhang Chao-Hui, Luo Jian-Bin, Wen Shi-Zhu. Effects of nano-scale particles in chemical mechanical polishing process. Acta Physica Sinica, 2005, 54(5): 2123-2127. doi: 10.7498/aps.54.2123
[20]	WANG FU-HE, YANG JIN-LONG, LI JIA-MING. THE MANIPULATION OF A SINGLE AL ATOM ON AL (111) SURFACE. Acta Physica Sinica, 1998, 47(11): 1827-1839. doi: 10.7498/aps.47.1827

Catalog

Vol. 70, Issue 6 - 2021-03-20

Metrics

Abstract views: 8182
PDF Downloads: 264
Cited By: 0

姓名
邮箱
手机号码
标题
留言内容
验证码

Search

Article

留言板