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本文叙述用Wright腐蚀剂对取向的硅外延片解理面进行择优腐蚀的观察结果。腐蚀后,硅外延片剖面上显示出层错、位错、S(Saucer)坑以及其它蚀坑。并观察到一些隐埋在外延层内的层错结构。In this paper results of observation using the Wright etchent on epitaxial silicon (111) cleavage surface are described. On silicon cleavage surface the etehent reveals stacking faults, dislocations, S-pits and other etch pits. Some of the buried stacking faults are also observed.







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