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中国物理学会期刊

Nb3Sn复合超导体晶粒生长机制

CSTR: 32037.14.aps.30.428

THE MECHANISM OF THE GRAIN GROWTH OF SUPERCONDUCTING COMPOUND Nb3Sn

CSTR: 32037.14.aps.30.428
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  • 本文研究了Nb/固态Cu-Sn和Nb/液态Cu-Sn界面上Nb3Sn晶粒的生长。实验表明:固态-固态界面上生长的晶粒尺寸虽小(约0.1μm),但Nb3Sn晶粒的长大仍符合通常的固态晶粒长大规律;固态-液态界面上生长的Nb3Sn分成两层,靠近Nb的内层晶粒细小,排列致密,外层晶粒粗大,分布零散,后者是前者经过溶解/沉积过程引起的,晶体形貌大多数呈菱形十二面体,部分呈正交平行六面体,说明Nb3Sn的110,100面

     

    Grain growth of the Nb3Sn at the Nb/solid Cu-Sn and Nb/liquid Cu-Sn interface has been investigated. Experiments have revealed that the grain growth of the Nb3Sn at the solid/solid interface still conforms to the ordinary law of the grain growth in metals, though the Nb3Sn grain size (~0.1 μm) is much smaller than that of the metals. The Nb3Sn layer growth at the solid/liquid interface is divided into two layers: (1) near the Nb, the grains are fine and closely packed, (2) near the liquid Cu-Sn, the grains are coarse and dispersive. The coarse grains, are thought to be formed by a solution/deposition process. Most of the Nb3Sn crystals have the appearance of rhombic dodecahedron and orthogonal parallelepiped. It is evident that the interfacial energy of the 110 and 100 planes of the Nb3Sn crystal is lower than the others.

     

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