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中国物理学会期刊

掺铬半绝缘砷化镓材料的硅离子注入

CSTR: 32037.14.aps.31.71

SILICON IMPLANTATION IN SEMI-INSULATING GaAs SUBSTRATE

CSTR: 32037.14.aps.31.71
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  • 本文研究了半绝缘砷化镓中硅离子的注入,在对衬底材料进行挑选和注意离子源工作物质纯度的基础上,进行了28Si+注入,用无包封法退火,然后对注入层作了电学性质、背散射和光致发光谱测定,结合选择离子注硅的UHF应用的低噪声GaAs双栅MESFET的结果,1GHz下NF0.9dB和Ga10dB,对实验结果进行了讨论。

     

    Semi-insulating GaAs substrates doped with chromium were implanted with 120-160 ke V28Si+ ions (1012-1013 cm-2 at room temperature. After thermal annealing, the carrier concentration and mobility profiles, residual damage and impurity levels of implanted wafer were determined by C-V method, back scattering technique and photo-1uminescence spectra. The results showed that the semi-insulating GaAs substrate selection and 28Si+ beam purity control are necessary to obtain reproducible and high activation implantation. Fabricated with multiple localized silicon implantation for both active and contact layer, GaAs dual-gate MES FET applicated in UHF TV tuner reached a noise figure of 0.9 dB and an associated gain of 10 dB at 1 GHz. The mobility profile and appropriate annealing temperature are discussed on the basis of the present experimental results.

     

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