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本文研究了掺Cr半绝缘GaAs中28Si+注入后的载流子浓度分布尾,包括退火温度和时间的影响。应用计算机模拟了分布尾对GaAsMESFET器件输出特性的影响,与实测结果符合,表明分布尾会造成器件输出特性异常。讨论了产生分布尾的原因,认为与GaAs衬底中残留Si等浅施主杂质和高温退火时Cr再分布有关。We studied the carrier profile tail formed in GaAs materials of 28Si+ implanting into Cr-doped semi-insulating substrate, including the effects of annealing temperature and time. The effects of carrier profile tail on GaAs MESFET output characteristics simulated by computer were in accord with measured results, indicating that the profile tail does make the abnormal output characteristics in MESFET. The origin of profile tail in connection with Si background in GaAs substrate and Cr redistribution during high temperature annealing was discussed.







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