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以50keV和100keV能量的氢离子注入p型(100)直拉硅单晶薄膜。注入剂量为1015—2×1017H+/cm2。试样在HU-1300型超高压透射电子显微镜中进行电子辐照和原位加热动态观察。结果表明在20—300℃温度范围内与未注氢硅相比,注氢硅在相同的电子辐照条件下产生的电子辐照缺陷较少,电子辐照缺陷形成所需的潜伏时间较长。在电子显微镜中加热试样时于190℃开始观察到氢泡,190—220℃范围内氢泡逐渐产生并长大The B-doped (100) CZ-Si single crystal films were implanted with 50 and 100 keV hydrogen ions in the concentration range of 1015-1017H+/cm2. The implanted specimens were electron irradiated at l000keV in HU-1300 HVEM. It was found that the electron irradiated defect density was higher ia Si with no hydrogen than in hydrogen implanted Si at the same irradiation condition within the temperature range 298-573 K. When hydrogen implanted Si films were heated insitu in HVEM from room temperature to 823 K, The hydrogen blisters were formed in k at about 473 K. The critical hydrogen concentration in Si for the formation of blister was 9×1016 H+/cm2. Hydrogen blisters had the form of convex lens with diameter 1000-5000 nm. The blister number density was about 1017/m2 in the 1017H+/cm2 implanted Si The formation of blister is related with the dissosiation of silicon-hydrogen bond in Si.







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