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中国物理学会期刊

PECVD硼掺杂微晶硅薄膜的压阻特性

CSTR: 32037.14.aps.37.1794

PIEZORESISTIVE PROPERTIES OF BORON-DOPED PECVD μc-Si FILMS

CSTR: 32037.14.aps.37.1794
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  • 研究了在硅片、柯伐合金和石英片等不同衬底材料上PECVD生长的微晶硅薄膜的压阻特性。测得以硅片和柯伐合金片作衬底样品的最大应变灵敏度因子(以下简称GF)分别为25和20,经激光退火后可达30。利用价带顶轻、重空穴带在应力作用下分裂模型和热电子发射理论推导了计算p型微晶、多晶硅薄膜GF的公式,可表示为GF对掺杂浓度、晶粒尺寸、晶界陷阱态密度以及薄膜织构的依赖关系,理论计算与实验结果较为符台。本文对微晶、多晶硅薄膜力敏器件的设计和制造将有重要的参考价值。

     

    The piezoresistive properties of boron-doped PECVD microcrystalline Si films (μc-Si) deposited on SiO2 coated Si, covar or quartz substrates have been investigated. The relations between the gauge factor (G. F.) and doping concentrations as well as the film thickness etc, have been obtained experimentally. The maximum longitudinal G. F. of 25 and 20 are measured for Si and covar substrates respectively. An expression for calculating G. F. of p-type μc-Si is derived theoretically by using the spliring model of heavy and light hole band at k = 0 and the thermionic emission theory. The calculated dependences of G. F. on the doping concentrations, grain size and trap state density agree well with the experimental results, which offer a better understanding of the piezoresistive characteristics of μc-Si or poly-Si, and enable to optimize the design and fabrication of the μc-Si or poly-Si strain gauges.

     

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