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对Ta2O5/Ta样品界面区的深度剖面曲线进行了研究。基于离子溅射引起影响层存在的考虑,提出一种解释该曲线的新模型。通过此模型能很好地拟合实验曲线,并反映了溅射过程中的离子混合效应、原子堆积效应及相应的特征参数。样品由阳极氧化法制得,其厚度为500埃。表面分析在PHI-590型扫描俄歇微探针上完成,所有测量均在室温下进行。研究表明:深度剖面曲线并不符合误差函数分布;影响层的厚度为30—50埃,它是进行深度剖面分析时,决定元素俄歇信号强度的第一位重要因素;深度剖面The depth profile of interface of Ta2O5/Ta sample has been investigated and a new model to explain the profile data based on the altered layer induced by bombardment of energetic ions during the sputtering has been proposed successfully. The experimental data can be fitted very well and the parameters characteristic of the ion mixing and pile up effect can also be obtained by this model. The samples were prepared by the method of anodic oxidation with a thickness of 500?. All the surface analyses were performed by scanning Auger microprobe model PHI-590 at room temperature. The following results have been obtained: In contradiction with the generally accepted point of view, the depth profile curve dose not exhibit the form of error function. The dominant factor for Auger signal during the interface analysis is the altered layer with a thickness of 30-50? rather than the electron mean free path λ. And the depth profile resolution of interface analysis is determined by compromise between the ion mixing and pile up effect.







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