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中国物理学会期刊

P2+和P+注入硅固相外延过程时间分辨的反射率研究

CSTR: 32037.14.aps.39.112

TIME RESOLVED REFLECTIVITY MEASUREMENTS OF SOLID PHASE EPITAXY IN P2+ AND P+ IMPLANTED SILICON

CSTR: 32037.14.aps.39.112
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  • 本文以时间分辨的反射率测量结合背散射和沟道分析、透射电子显微镜分析,比较和研究了在77K温度下180keV,1×1014/cm2P2+和90KeV,2×1014/cm2P+注入硅于550℃退火时的固相外延过程。发现了P2+,P+注入硅样品的固相外延过程具有不同的特征。这种差异是由于P2+和P+在硅中引入不同的损伤造成的。P+注入的硅样品测量得到的时间分辨的反射谱是反常的。这种反常谱可用样品退火时从表面层到非晶硅层与从衬底到非晶硅层的双向外延的过程给出满意的解释。

     

    The solid phase epitaxy processes of (100) Si implanted at 77K by 180 keV, 1×1014/cm2 P2+ and 90keV, 2×1014/cm2 P+ have been investigated by using time resolved reflectivity (TRB), Rutherford back scattering and channeling (RBS/C), and cross sectional transmission electron microscopy (XTEM). The difference of TRR spectra between P2+ and P2+ implanted samples annealed at 550℃ is due to the difference in implantation damage of the two different implants. Anomalous TRR spactra for P+ implanted sample can be explained by a model of two direction epitaxial growth from surface layer to amorphous layer and from substrate to amorphous layer.

     

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