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中国物理学会期刊

金属薄膜在云母与富勒烯衬底上的电阻弛豫现象

CSTR: 32037.14.aps.46.387

RESISTANCE RELAXATION OF THIN METAL FILMS ON MICA AND FULLERENE SUBSTRATES

CSTR: 32037.14.aps.46.387
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  • 超高真空环境中,在云母和富勒烯衬底上蒸镀半连续的Nb和Ag膜,同时对其进行了原位电阻测量.在人为地突然中断蒸镀之后的10min内,仔细研究了样品电阻随时间的自动缓变过程(弛豫).实验发现,Nb/云母和Ag/C60样品的电阻随时间缓慢增加,Ag/云母样品的电阻随时间逐渐减小.样品弛豫的强度与衬底温度和金属膜厚度密切相关.分析表明,衬底上的金属原子徙动会引起金属岛的边际形变以及岛间融合,这是薄膜电阻弛豫的主要原因.电阻弛豫的方向与强度反映了金属膜/衬底系统的界面活性.衬底表面的缺陷也会影响这一弛豫过程.从微观的原子运动和宏观的热力学平衡这两方面描述了弛豫过程

     

    In situ DC resistance measurements were performed on semicontinuous niobium and silver films,which were made on mica and fullerene substrates in an ultra-high-vacuum chamber.Right after the interruption of the deposition,we investigated the changes (relaxation) of the sample resistance on a time scale of about 10 minutes.Resistance increase was observed for Nb/mica and Ag/C60 systems,and decrease for Ag/mica system.The relaxation is sensitive to substrate temperature and film thickness.We suggest that the edge diffusion and mergence of islands due to thermomigration of the metal atoms are responsible for the resistance relaxation.The intensity and direction of the relaxation reflect the interfacial activity of the metal/substrate system.The heterogeneities on substrate may also play an important role during this process.The analysis is presented from the angle of atom-migration and of thermodynamic evolution.

     

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