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中国物理学会期刊

B+注入HgCdTe快速热退火的研究

CSTR: 32037.14.aps.47.47

STUDY OF B+-IMPLANTED HgCdTe UNDER RAPID THERMAL ANNEALING

CSTR: 32037.14.aps.47.47
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  • 借助二次离子质谱和俄歇电子能谱对B+注入HgCdTe有无ZnS膜包封在快速热退火条件下表层的Hg损失进行了深入的分析-快速热退火温度为300,350和400℃,退火时间为10s-ZnS膜厚度为160nm-结果表明,300℃,10s快速热退火后,有ZnS膜包封的HgCdTe表层没有Hg损失-对B+注入HgCdTe N+-P结快速热退火工艺流程进行了优化-结果表明,快速热退火放在光刻金属电极之后进行,可以改善结的特性-

     

    Hg loss of B+-implanted HgCdTe with and without a ZnS film under rapid thermal annealing(RTA) has been analysed by secondary ion mass spectroscopy and Auger electron spectroscopy in detail- The temperatures for RTA are 300, 350 and 400℃, and the duration is 10s- The thickness of ZnS film is 160nm- Results obtained show that the surface layer of HgCdTe with a ZnS film does not show Hg loss after RTA (300℃,10s)- The procedure of RTA for B+-implanted HgCdTe forming N+-P junction has been optimized- It was shown that RTA carried out after the lithography of the metal electrode can improve the junction characteristics-

     

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