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中国物理学会期刊

ECR-PECVD制备Si3N4薄膜沉积工艺的研究

CSTR: 32037.14.aps.48.1309

INVESTIGATION ON THE DEPOSITION PROCESS OF SILICON NITRIDE THIN FILM PREPARED BY ECR-PECVD

CSTR: 32037.14.aps.48.1309
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  • 由偏心静电单探针诊断了电子回旋共振等离子体增强化学汽相沉积(ECR-PECVD)反应室内等离子体密度的空间分布规律.结果表明在轴向位置Z=50cm处,直径Φ12cm范围内等离子体密度分布非常均匀.分析了等离子体密度径向均匀性对沉积速率均匀性和薄膜厚度均匀性的影响.讨论了沉积制备一定薄膜厚度的Si3N4薄膜的工艺重复性.研究了各种沉积工艺参数与Si3N4薄膜沉积速率的相互关系.得到了ECR-PECVD技术在沉积薄膜时的工

     

    The spatial distribution of the ECR plasma density has been measured by using an eccentric Langmuir probe. The result indicates that the plasma density is very uniform in the axis Z=50 cm and radial Φ=12 cm. Effect of the radial uniformity of plasma density on the uniformity of deposition rate and thin film thickness is analyzed. The repeatability to prepare silicon nitride thin film of a specified thickness is discussed. The relation of the deposition process with the deposition rate of silicon nitride thin film is investigated and the dependence of the practical application on process parameters has been obtained for the deposition thin film with ECR-PECVD technology.

     

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