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中国物理学会期刊

用分步注入法改善SOI-SIMNI薄膜材料的电学性能

CSTR: 32037.14.aps.50.185

IMPROVEMENT IN ELECTRICAL PROPERTIES OF SIMNI FILMS BY MULTIPLE-STEPS IMPLANTATION

CSTR: 32037.14.aps.50.185
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  • 采用常规方法和分步注入法制备SOI-SIMNI(Silicon on Insulator-Separation by Implantation of Nitrogen)薄膜材料,用液氦低温霍耳效应进行了分析测量。测量结果表明:分步注入法制备得到的样品具有低的薄层电阻R和较高的载流子迁移率。实验证明用分步注入法可以明显改善SIMNI薄膜材料的电学性能,对实验结果和机理进行了解释。

     

    SOI-SIMNI (Silicon On Insulator-Separation by Implanted Nitrogen) films were formed by standard and multiplestep implantation methods. The Hal-l effects measurements (4-300K) show that the multiple-step implanted SIMNI films have a lower sheet resistance and higher carrier mobility than those in standard SIMNI films. The DLTS results indicated that there is a deep level defects Et=0.152eV in the standard SIMNI films‚, and no deep level defects in the multiple-step implanted SIMNI films‚, which have good electrical properties.

     

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