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中国物理学会期刊

脉冲直流偏压增强的高质量立方氮化硼薄膜的合成

CSTR: 32037.14.aps.50.2258

DEPOSITION OF HIGH-QUALITY c-BN FILM ENHANCED BY PULSED DC BIAS TECHNIQUE

CSTR: 32037.14.aps.50.2258
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  • 采用磁增强活性反应离子镀系统成功地合成了立方氮化硼薄膜.通过给基片施加脉冲直流偏压以代替传统的射频偏压,增强了立方氮化硼的成膜稳定性,研究了基片的直流脉冲偏压、等离子体放电电流、通入气体流量比(Ar/N2)和基片温度沉积参数对立方氮化硼薄膜形成的影响规律.结果表明:随着基片负偏压和放电电流的增大,薄膜中立方氮化硼的纯度提高,当基片负偏压为155V,放电电流为15A时,可获得几乎单相的立方氮化硼薄膜.基片温度为500℃和Ar/N2流量比为10时,最有利于立方氮化硼

     

    Cubic boron nitride (c-BN) films were synthesized using magnetically enhanced active reaction evaporation system in which pulsed DC technique was employed to enhance the formation of c-BN film. The effect of pulsed DC bias, plasma discharge current, Ar/N2 flow ratio, substrate temperature on the formation of c-BN films was investigated. The friction of c-BN phase in the film increased with the increase of pulsed DC negative bias and discharge current.Almost single phase c-BN films were obtained when deposited at-155V of pulsed DC bias,15A of discharge current,500℃ of substrate temperature and 10 of Ar/N2 flow ratio.

     

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