Abnormal grain growth and texture change in free-standing Ag and Cu films and those attached to the Si substrates have been investigated with transmission electron microscopy (TEM) and x-ray diffraction (XRD) analysis, after annealing the samples at 300℃ for 2 h.The as-deposited Ag and Cu films, as shown by XRD analysis, have(111) and (100) preferred orientations. After annealing, the free-standing films show a slight increase in the (111) texture, while the films attached to the silicon substrates show strong increases in the (100) and (110) textures. Two anomalous large grains with (110) orientation and four anomalous large grains with (211) orientation are observed by TEM in the attached Cu film after annealing. The results are discussed from an energy point of view.