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中国物理学会期刊

热丝化学气相沉积技术低温制备多晶硅薄膜的结构与光电特性

CSTR: 32037.14.aps.52.2934

Structual and optoelectronic properties of polycrystalline silicon thin films p repared by hot-wire chemical vapor deposition at low temperatures

CSTR: 32037.14.aps.52.2934
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  • 以金属W和Ta为热丝,采用热丝化学气相沉积 ,在250℃玻璃衬底上沉积多晶硅薄膜.研究了热丝温度、沉积气压、热丝与衬底间距等沉积参数对硅薄膜结构和光电特性的影响,在优化条件下获得晶态比Xc>90%,暗电导率σd=10-7—10-6Ω -1cm-1,激活能Ea=0.5eV,光能隙Eopt≤1.3 eV的多晶硅薄膜.

     

    Polycrystalline silicon thin films were prepared by hot-wire chemical vapor deposition (HWCVD) on glass at 250℃,with W or Ta wire as the catalyzers. The structual and optoelectronic properties as functions of the filament temperature, deposition pressure and the filament-substrate distance were studied,and the optimized polycrystalline silicon thin films were obtained with Xc>90% (Xc denotes the crystalline ratio of the film), crystal grain size ab out 30—40nm, Rd≈0.8nm/s, σd about 10-7—10-6 Ω-1cm-1,Ea≈0.5eV and Eopt≤1.3eV.

     

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