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中国物理学会期刊

基于小波变换Cu-W薄膜表面形貌表征与硬度值分散性评价

CSTR: 32037.14.aps.53.2281

Morphological characterization and nanoindentation hardness scatter evaluation for Cu-W thin films based on wavelet transform

CSTR: 32037.14.aps.53.2281
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  • 提出了一种基于小波变换描述薄膜表面形貌的方法.运用离散小波变换法研究磁控溅射Cu-W薄膜表面特征随溅射时间的演变.结果表明,Cu-W薄膜在溅射时间超过600s时才达到稳定.不同薄膜表面形貌的变化主要是由高频部分引起.薄膜的粗糙表面会引起纳米压入硬度值的分散,这种分散性可用基于小波变换的薄膜表面形貌多尺度分解评价.

     

    A strategy based on wavelet transform to describe surface morphology of thin films is presented in this paper.The evolution of surface morphology of Cu-W thin films with deposition time on silicon wafers was investigated by discrete wavelet transform (DWT) method. The results show that the surface morphology of the thin films is unstable until the sputtering time exceeds 10 min. The surface morphology variation of different thin films can be distinguished primarily by high frequency signals.A scattering of the nanoindentation hardness values, which results from the roughness of the thin films surface, can be characterized by the roughness defined by the surface texture based on wavelet transform.

     

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