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中国物理学会期刊

铝诱导非晶硅薄膜的场致低温快速晶化及其结构表征

CSTR: 32037.14.aps.53.582

Aluminum-induced rapid crystallization of a-Si films at low temperatures in an electric field and microstructure analyses of the crystallized films

CSTR: 32037.14.aps.53.582
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  • 铝诱导非晶硅薄膜晶化可以降低退火温度、缩短退火时间,是制备多晶硅薄膜的一种重要方法.在此基础上,通过在退火过程中加入电场加速了界面处硅、铝原子间的互扩散,实现了非晶硅薄膜的快速低温晶化.实验结果表明,外加电场,退火温度为400℃,退火时间为60min时,薄膜的晶化率大于60%;退火温度为450℃退火时间为30min时,薄膜已经呈现明显的晶化现象;退火温度为500℃退火时间为15min时,薄膜的x射线多晶峰强度与非晶峰强度之比为未加电场的3—4倍.

     

    Aluminum-induced crystallization of amorphouse silicon (a-Si) is a suitable method for preparation of polycrystalline silicon (poly-Si) films. Biasing an electric field, which is perpendicular to the surface of the a-Si films, will accelerate the mutual diffusion of Al atoms and Si atoms in the interface during the aluminum-induced crystallization process and enhance the crystallization of the a-Si films obviously. The experimental results show that under the action of the electric field, more than 60% of a-Si transfer into poly-Si when the a-Si film was annealed at Ta=400℃ and annealing time ta=60min; the a-Si films have obviously crystallized at Ta=450℃ and ta=30min; at Ta=500℃ and ta=15min, the XRD intensity of crystalline silicon (c-Si) components in the films is thrice to fourfold as strong as that in the films without the effect of an electric field.

     

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