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中国物理学会期刊

超薄栅氧化层n-MOSFET软击穿后的导电机制

CSTR: 32037.14.aps.54.3884

Conduction mechanism of ultra-thin gate oxide n-MOSFET after soft breakdown

CSTR: 32037.14.aps.54.3884
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  • 研究了恒压应力下超薄栅氧化层n型金属-氧化物-半导体场效应晶体管(n-MOSFET)软击穿 后的导电机制.发现在一定的栅电压Vg范围内,软击穿后的栅电流Ig符合Fowl er-Nordheim隧穿公式,但室温下隧穿势垒b的平均值仅为0936eV,远小于S i/Si O2界面的势垒高度315eV.研究表明,软击穿后,处于Si/SiO2界 面量子化能级上的 电子不隧穿到氧化层的导带,而是隧穿到氧化层内的缺陷带上.b与缺陷带能 级和电 子所处的量子能级相关;高温下,激发态电子对隧穿电流贡献的增大导致b逐 渐降低.

     

    The conduction mechanism of ultra-thin gate oxide n-metal-oxide-semiconductor fi eld effect transistor (n-MOSFET) after soft breakdown is studied in this paper. It is found that in a certain range of gate voltage Vg, the gate cur r ent Ig follows the Fowler-Nordheim-like tunneling mechanism, and the experimen tal tunneling barrier b is 0936 eV in average, which is much smal ler t han the interface barrier of Si/SiO2 We think that after soft brea kdown, the electrons existing in the quantization energy levels of the Si/SiO2 interface , not directly tunnel to the oxide conduction band, but tunnel to the oxide defe ct band. b is determined by both the defect band energy level and t he qu antization energy level of the tunneling electrons. With rising experimental tem perature, the tunneling of high energy level electron is also increasing, which reduces b gradually.

     

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