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中国物理学会期刊

用SCLC法研究低k多孔SiO2:F薄膜的隙态密度

CSTR: 32037.14.aps.55.2936

Density of defect states in low-k porous SiO2:F film researched by SCLC method

CSTR: 32037.14.aps.55.2936
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  • 用溶胶-凝胶法制备了低k多孔SiO2:F薄膜,用空间电荷限制电流法(SCLC)研究了多孔SiO2:F薄膜中的隙态密度以及掺F量对隙态密度的影响,得到了平衡费米能级附近的隙态密度约为7×1015cm-3·eV-1,以及带隙中隙态随能量的分布. 并对造成隙态的主要原因也进行了讨论.

     

    The porous fluorine doped silica (SiO2:F) films were prepared by sol-gel method. The densities of the states (DOS) of the SiO2:F films and the effect of the dose of the F dopant were studied by space charge limited current(SCLC) techniques. Distribution of defect states N(E) in the vicinity of Fermi level in SiO2:F films was determined to be about 7×1015cm-3·eV-1. The dangling bounds on the surface of the porous film were the primary cause of the DOS.

     

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