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中国物理学会期刊

氢化硅薄膜介观力学行为及其与微结构内禀关联特性

CSTR: 32037.14.aps.56.4834

Mesoscopic mechanical characterization of hydrogenated silicon thin film and the intrinsic relationship with the microstructure

CSTR: 32037.14.aps.56.4834
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  • 使用等离子体增强化学气相沉积系统,在射频和直流负偏压的双重激励下制备了本征和掺杂后的氢化硅薄膜.利用拉曼谱对薄膜进行了微结构分析,用纳米压痕系统研究了薄膜的介观力学行为.研究表明:制备于玻璃衬底上的氢化硅薄膜,由于存在非晶态的过渡缓冲层,弹性模量小于相应的制备于单晶硅衬底的薄膜.对于掺杂的氢化硅薄膜,由于磷的掺入使得薄膜晶粒细化、有序度提高,薄膜的晶态比一般在40%以上.而硼的掺入,薄膜晶态比减小,一般低于40%.同时发现,掺磷、本征和掺硼的氢化硅薄膜分别在晶态比为45%,30%和15%左右处,弹性模量较

     

    Hydrogenated silicon films were deposited on glass and single crystalline silicon substrate in a capacitively coupled radio-frequent plasma enhanced vapor deposition system aided by direct current bias excitation. Hydrogenated silicon films are used to realize a silicon material that consists of a two-phase mixture of amorphous and ordered silicon. Micro-Raman scattering is employed to investigate the thin film microstructure. The crystalline volume fraction (Xc) is obtained from the Raman spectra. Mesoscopic mechanical characterization of the thin film is done by nanoindentation based on the conventional depth-sensing indentation method. An analytical relation between Xc and elastic modulus is established. It is shown that the elastic modulus of the film on glass substrate is lower than that on silicon with the the same Xc. The grain size of phosphorus doped thin film is smaller than that of the intrinsic one and more ordered. The Xc is usually above 40%. The film with diborane doping is on the opposite, the Xc of which is usually below 40%. For P-doped, intrinsic and B-doped fims, when the Xc values are 45%, 30% and 15%, respectively, the values of elastic modulus are minimal.

     

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