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中国物理学会期刊

电化学制备薄黑硅抗反射膜

CSTR: 32037.14.aps.57.514

“Black silicon" antireflection thin film prepared by electrochemical etching

CSTR: 32037.14.aps.57.514
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  • 采用计算机控制电流密度按指数规律衰减对单晶硅进行电化学腐蚀,得到了折射率随薄膜厚度连续均匀变化的抗反射膜,即黑硅样品. 这种在制取上快速、经济和工艺非常简单的样品,不仅在较宽波段范围内反射率小于5%,且整个薄膜厚度不足1μm. 利用传输矩阵方法对黑硅样品的反射谱进行模拟,得到了理论与实验符合较好的结果.

     

    Solar cells and optical detection devices are often covered with antireflective surfaces to enhance their performance. An economical, fast, and easily operational electrochemical etching technique has been developed to realize a continuous uniform variation in the refractive index of porous silicon layer as a function of the etching depth. By using this technique a black silicon sample was fabricated, which has a reflectance below 5% over a broad band and a thickness below 1μm. The depression mechanism of the optical reflectance is analyzed by simulating the structure with the transfer matrix method. The simulated results give a good agreement with the experimental measurements.

     

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