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中国物理学会期刊

微波ECR磁控溅射制备SiNx薄膜的XPS结构研究

CSTR: 32037.14.aps.58.4109

An XPS study on the structure of SiNx film deposited by microwave ECR magnetron sputtering

CSTR: 32037.14.aps.58.4109
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  • 利用微波电子回旋共振等离子体增强非平衡磁控溅射法在不同N2流量下制备无氢SiNx薄膜.通过X光电子能谱、纳米硬度仪等表征技术,研究了不同N2流量下制备的SiNx薄膜的化学键结构、化学键含量、元素配比及各元素沿深度分布.研究结果表明,N2流量是影响SiNx薄膜化学键结构、元素配比、元素延深度分布等性质的主要因素.在N2 

    Hydrogen-free SiNx films were deposited at N2 flow rate ranging from 1 sccm to 20 sccm by microwave electron cyclotron resonance plasma enhanced unbalance magnetron sputtering system. We studied the influence of N2 flow rate on the structural characteristics of deposited films in chemical structure, stoichiometry, composition at different depths in film, and hardness by using X-ray photoelectron spectroscopy and nano-indantation. The results indicate that the films deposited at low N2 flow rate are Si-rich structure. The films deposited at 2 sccm N2 flow rate show an excellent stoichiometry with 94.8% Si—N bond content and uniformity of composition in different depths. At the same time, the films display the highest hardness value of 22.9 GPa. The films deposited at high N2 flow rate contain too much N—Si—O bond and Si—O bond, which is caused by chemical absorption both on and in film in atmosphere. The films present N-rich structure. In this situation, the films display poor mechanical properties with hardness of only 12 GPa.

     

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