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中国物理学会期刊

沉积参数对SiNx薄膜结构及阻透性能的影响

CSTR: 32037.14.aps.58.432

Influence of deposition parameter on chemical structure and moisture resistant properties for SiNx films deposited by DC pulse magnetron sputtering

CSTR: 32037.14.aps.58.432
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  • 利用直流脉冲磁控溅射法在室温下制备无氢SiNx薄膜.通过傅里叶变换红外光谱、台阶仪、紫外—可见分光光度计、接触角测量仪、透湿测试仪等表征技术,分析了N2流量、Si靶溅射功率等实验参数对SiNx薄膜成分、结构、及阻透性能、透光性能、接触角等性能的影响.研究结果表明,Si靶溅射功率固定时,在低N2流量条件下,或N2流量固定时,在高Si靶溅射功率条件下,制备的SiN

     

    Hydrogen-free SiNx films were deposited by direct current pulse magnetron sputtering at room temperature. We have studied the influence of N2 flow rate and Si target sputtering power on the structural characteristics and properties of deposited films by using Fourier-transform infrared spectroscopy,auto water vapor permeability tester,ultraviolet-visible spectrophotometer,stylus profilometer,and contact angle measurement. The results indicate that the content of Si—O bonding in SiNx films increaseds and moisture resistant property of SiNx films decreases with increasing N2 flow rate or decreasing Si target sputtering power. The films deposited at 300W of Si sputtering power and 6sccm of N2 flow rate show excellent water vapor permeability (0.764) with transmittance higher than 97.5% in visible range.

     

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