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采用离子束溅射技术交替沉积Sb-Te-Sb多层薄膜后进行高真空热处理,直接制备Sb2Te3薄膜.利用X射线衍射(XRD)仪、霍尔系数测试仪、薄膜Seebeck系数测量系统对所制备的薄膜特性进行表征.XRD测量结果显示,薄膜的主要衍射峰与Sb2Te3标准衍射峰相同,在[101]/[012]晶向取向明显,存在较多的Te杂质峰;霍尔系数测试结果表明,薄膜为p型半导体薄膜,薄膜电阻率较低,其电导率接近于金属电导率,载流子浓度量级为1023 cm-3,具有良好的电学性能;Seebeck系数测量结果显示,薄膜具有良好的热电性能,在不同条件下制备的薄膜的Seebeck系数在7.8—62 μV/K范围;在所制备的薄膜中,退火时间为6 h、退火温度为200 ℃的薄膜其Seebeck系数达到最大,约为62 μV/K,且电阻率最小.Antimony and tellurium were deposited alternatively on the substrates by ion beam sputtering with 11 periodic layers of Sb/Te deposited. The films were then annealed at the vacuum chamber. The properties of the thin films were tested by X-ray diffraction (XRD), Hall measurement and Seebeck coefficient measurement systems. XRD results indicate that the major diffraction peaks of the film match those of Sb2Te3. The film growth is apparently at the [101]/[012] orientation and many Te peaks are observed. Hall measurement reveals that all the samples are p-type and the resistivities are low. The electric conductivity of the films approaches that of the bulk metal and the carrier concentration is of 1023 cm-3. Seebeck coefficient measurement shows that the samples have nice thermoelectrical properties and the seebeck coefficients are in the range of 7.8—62 μV/K. Among all, the samples annealed at 200 ℃ for 6 h have the highest seebeck coefficient of about 62 μV/K and the lowest resistivity.
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Keywords:
- ion beam sputtering /
- Sb2Te3 thin films /
- thermoelectric material /
- heat treatment







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