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中国物理学会期刊

退火温度和退火气氛对Ni/Au与p-GaN之间欧姆接触性能的影响

CSTR: 32037.14.aps.62.206801

Influence of different annealing temperature and atmosphere on the Ni/Au Ohmic contact to p-GaN

CSTR: 32037.14.aps.62.206801
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  • 研究了不同退火温度和气氛对Ni/Au与p-GaN之间欧姆接触性能的影响. 采用圆形传输线模型方法得到不同退火温度和不同退火气氛下的比接触电阻率. 结果表明, 较适宜的退火温度为500 ℃左右, 退火温度太高或太低都会导致比接触电阻率的增大; 较适宜的退火气氛为适量含氧的氮气气氛, 且氧气含量对比接触电阻率大小的影响并不显著. 经过对退火条件的优化, 得到的比接触电阻率可达7.65×10-4 Ω·cm2.

     

    In this paper, we investigate the effect of annealing conditions on the characteristic of Ni/Au Ohmic contact to p-GaN. The specific contact resistivities under different annealing temperature and different annealing atmosphere are tested using the circular transmission line model. It is found that the best annealing temperature is about 500 ℃. The annealing atmosphere of nitrogen-oxygen gas mixture can lead to lower specific contact resistivity than that of pure nitrogen, and the specific contact resistivity has no relationship with the content of oxygen. Finally, we obtain the lowest specific contact resistivity to be 7.65×10-4 Ω·cm2 at the best annealing temperature and atmosphere.

     

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