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中国物理学会期刊

铒离子注入绝缘体上Si的射程分布研究

CSTR: 32037.14.aps.63.176101

Investigation on range distribution of Er ions implanted in silicon-on-insulator

CSTR: 32037.14.aps.63.176101
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  • 利用离子注入掺杂技术设计、制作半导体集成器件时,了解离子注入半导体材料的射程分布和横向离散规律等是很重要的. 用200500 keV能量的铒(Er)离子注入SOI(silicon-on-insulator,绝缘体上的硅)样品中,利用卢瑟福背散射(RBS)技术研究了剂量为21015 cm-2的Er离子注入SOI的平均投影射程Rp和射程离散Rp,把测出的实验值和SRIM软件得到的理论计算值进行了比较,发现平均投影射程Rp的实验值跟理论计算值符合较好,射程离散 Rp的实验值和理论计算值差别大一些.

     

    It is very important to take into consideration the distribution of range, range straggling, and lateral spread of ions implanted into semiconductor materials during designing and fabrication of semiconductor integration devices by means of ion implantation. Er ions with energies between 200 and 500 keV are implanted in SOI (silicon-on-insulator) samples. The mean projection range Rp and the range stragglings Rp of Er ions with a dose of 21015 cm-2 implanted in SOI samples are measured by Rutherford backscattering (RBS) technique. The obtained data are then compared with those predicted by TRIM codes. It is seen that the experimental data of Rp agree well with the theoretical values. However, there are great differences between the experimental data and the theoretical values of Rp.

     

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